Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: An embodiment of a resonant converter includes having resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied and a synchronous rectifier coupled between at least a portion of the resonant circuitry and an output of the resonant converter. The synchronous rectifier includes a diode, and an electrical switch. Control circuitry is configured to operate the electrical switch such that the electrical switch is turned on when there is substantially no voltage across the diode and current flow in the diode is positive in a direction from anode to cathode.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: An embodiment of a resonant converter includes having resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied and a synchronous rectifier coupled between at least a portion of the resonant circuitry and an output of the resonant converter. The synchronous rectifier includes a diode, and an electrical switch. Control circuitry is configured to operate the electrical switch such that the electrical switch is turned on when there is substantially no voltage across the diode and current flow in the diode is positive in a direction from anode to cathode.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: A method of operating a power adapter having multiple outputs includes setting an output priority for each of the multiple outputs and providing an output voltage at each of the multiple outputs. The method also includes measuring one or more operating parameters of the power adapter and determining that at least one of the one or more operating parameters are greater than a setpoint. The method further includes reducing the output voltage associated with at least one of the multiple output ports.

Abstract: A variable output power supply includes a power unit comprising a housing including an output port and a controller disposed in the housing and in communication with the output port. The variable output power supply also includes a power cable. The controller is operable to modify operation of the output port in response, at least in part, to insertion of the power cable in the output port.

Abstract: An embodiment of non-isolated resonant converter includes resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied, a first electrical switch coupled to the resonant circuitry such that the first electrical switch conducts a current of the resonant circuitry, and voltage-monitoring circuitry coupled to the resonant circuitry and configured to determine when there is substantially no voltage across the first electrical switch. The non-isolated resonant converter further includes control circuitry configured to receive an input from the voltage-monitoring circuitry, and operate the first electrical switch. The control circuitry is configured to turn the first electrical switch on when substantially no voltage is detected across the first electrical switch.

Abstract: An embodiment of a resonant converter includes having resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied and a synchronous rectifier coupled between at least a portion of the resonant circuitry and an output of the resonant converter. The synchronous rectifier includes a diode, and an electrical switch. Control circuitry is configured to operate the electrical switch such that the electrical switch is turned on when there is substantially no voltage across the diode and current flow in the diode is positive in a direction from anode to cathode.

Abstract: An embodiment of a resonant converter includes having resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied and a synchronous rectifier coupled between at least a portion of the resonant circuitry and an output of the resonant converter. The synchronous rectifier includes a diode, and an electrical switch. Control circuitry is configured to operate the electrical switch such that the electrical switch is turned on when there is substantially no voltage across the diode and current flow in the diode is positive in a direction from anode to cathode.

Abstract: The present application is directed at pin programming od controllers for power converters and provides for the programming of a plurality of different controller parameters using a single programming resistor. The value of the programming resistor is used as a pointer to select a table storing a plurality of different settings for the controller.

Abstract: The present invention relates to power converters of the type known generally as switch mode power converters (SMPCs). In particular, the present invention addresses the problem of reducing thermal stress across the phases of a multi phase converter. Specifically, a method of controlling a multi-phase switch mode power arrangement is provided. The multi-phase arrangement comprises a plurality of phases configured to deliver DC power to a common load. The method comprises the steps of: determining the thermal stress of each phase along with at least one other stress for each phase and controlling the share of DC power provided by the individual phases in an effort to equalize the thermal and other stress across the individual phases.

Abstract: The present invention relates to power converters of the type known generally as switch mode power converters (SMPCs). In particular, the present invention addresses the problem of reducing thermal stress across the phases of a multi phase converter. Specifically, a method of controlling a multi-phase switch mode power arrangement is provided. The multi-phase arrangement comprises a plurality of phases configured to deliver DC power to a common load. The method comprises the steps of: determining the thermal stress of each phase along with at least one other stress for each phase and controlling the share of DC power provided by the individual phases in an effort to equalise the thermal and other stress across the individual phases.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.