Abstract: Provided is a manufacturing method of a radio-frequency (1A, 1B) smart card with a metal inlay (4), comprising the steps of forming a card body (1 A, 1B, 11) including said metal inlay (4) in the form of a metal plate (4i) equipped with a cavity (22), and arranging at least a radiofrequency transponder (5c) antenna inside this cavity (22). The method is characterized in that it comprises a step of arranging an external metal element (4c) around said metal plate (4i) for forming the metal inlay (4), said external metal element being visible on the edge (14) of the card (11).

Abstract: Provided is a multilayer structure manufacturing method for bonding layers with adhesive film(s), comprising the steps of bonding one or more layers (4, 8, 5, 6) of its structure (1, 7) with thermosetting adhesive film(s) (2, 3), said thermosetting adhesive film(s) having recommended operating conditions of temperature and duration in its technical specification (TDS) to polymerize during thermal lamination (500, 600). The thermosetting adhesive is laminated with said layers in order to present a partial polymerization rate less than polymerization rate resulting from said recommended operating conditions.

Abstract: The invention relates to a method for producing an intermediate device comprising an electronic module, said intermediate device being used to receive at least one film or portion of a film or covering layer, said device comprising: a supporting body; at least one area for the interconnection of an electric circuit, borne by the supporting body; and an electronic module connected to said interconnection area by an anisotropic connection material, said material being compressed between said area and the module. The method comprises the implementation of a means for maintaining the compressed state of said anisotropic material and/or a means for isolating said material from the outside of the supporting body.

Abstract: The invention relates to a method for producing an intermediate device comprising an electronic module, said intermediate device being used to receive at least one film or portion of a film or covering layer, said device comprising: a supporting body; at least one area for the interconnection of an electric circuit, borne by the supporting body; and an electronic module connected to said interconnection area by an anisotropic connection material, said material being compressed between said area and the module. The method comprises the implementation of a means for maintaining the compressed state of said anisotropic material and/or a means for isolating said material from the outside of the supporting body.

Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.

Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.

Abstract: The embodiments of this invention also describe to a data medium comprising a holographic memory carried on the medium, and a photonic crystal configured, firstly, to filter the light received from a broad-spectrum light source in order to select a frequency band of the said spectrum and secondly, to guide the light corresponding to the said selected frequency band so as to light the said holographic memory in a predefined direction.