Abstract: A method of forming a pattern, the method comprising applying a layer of a coating composition over a substrate; curing the applied coating composition to form a coated underlayer; and forming a photoresist layer over the coated underlayer, wherein the coating composition comprises a first material comprising two or more hydroxy groups; a second material comprising two or more glycidyl groups; an additive comprising a protected amino group; and a solvent.

Abstract: There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.

Abstract: A method of forming a pattern, the method comprising: providing a photoresist underlayer over a substrate; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer; wherein the photoresist underlayer is formed from a composition comprising a solvent and a compound represented by Formula 1 or a polymer having a repeating unit represented by Formula 2 wherein in Formulae 1 and 2: Ar1 and Ar2 independently represent an aromatic group; and Y1, Y2, X1, X2, X3, T1, T2, Z1, and Z2 are as defined.

Abstract: A method of forming a pattern, the method comprising: applying a photoresist underlayer composition over a substrate to provide a photoresist underlayer; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer. The photoresist underlayer composition includes a polymer that includes a repeating unit represented by Formula 1 as described herein, a compound including a substituent group represented by Formula 2 as described herein, and a solvent.

Abstract: A photoresist underlayer composition, comprising a first material comprising two or more hydroxy groups; a second material comprising two or more glycidyl groups; an additive, wherein the additive comprises a compound of Formula (5), a compound of Formula (6), or a combination thereof; and a solvent, wherein the structures of Formula (5) and (6) are as disclosed herein.

Abstract: A method of forming a pattern, the method comprising applying a layer of a coating composition over a substrate; curing the applied coating composition to form a coated underlayer; and forming a photoresist layer over the coated underlayer, wherein the coating composition comprises a first material comprising two or more hydroxy groups; a second material comprising two or more glycidyl groups; an additive comprising a protected amino group; and a solvent.