Abstract: A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

Abstract: One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

Abstract: An electronic device with a clip and a plate of thermally conductive material is disclosed. A first surface of the plate is attached to a surface of the electronic device. The clip is arranged on a second surface of the plate. Two ends of the clip clasp the electronic device and the plate at opposed edges of the electronic device, pressing the plate to the electronic device.

Abstract: A system including an electronic module with a heat spreader. One embodiment provides a plate including a thermally conductive material and a guiding member arranged along an edge of the plate. The plate and the guiding member of the heat spreader are configured to form, when attached to a first memory module, together with another heat spreader attached to a second memory module or together with a wall of another device, a duct channeling a flow of a coolant.

Abstract: Clip for attaching two outer panels to an intermediate panel, the clip comprising two arm portions each arm portion being configured to apply pressure to one of the outer panels in order to force the panel against a surface of the intermediate panel, and a bridge portion connecting the two arm portions, the bridge portion comprising a central section configured to provide mechanical coupling to the intermediate panel.

Abstract: A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

Abstract: A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader.

Abstract: The invention relates to a memory module heat sink, in particular for FB-DIMM memory modules, for dissipating heat generated in the memory module to the outside, having an essentially planar metal plate (100, 150) to which the memory module can be fixed, wherein the metal plate (100, 150) has on its outer edge a stiffening element (110, 160) that runs at least partially along the outer edge.

Abstract: The present invention provides a method for connection of an integrated circuit (1), in particular of a chip, a wafer or a hybrid, to a substrate (10), which has the following steps: provision of an elastic intermediate layer (5) on the integrated circuit (1) and/or the substrate (10); structuring of the elastic layer (5) in raised areas (5a) and recessed areas (5b); and connection of the substrate (10) and of the integrated circuit (1) via the structured elastic intermediate layer (5). The invention likewise provides a corresponding circuit arrangement.

Abstract: A system including a heat transfer apparatus is disclosed. One embodiment provides for an electronic device and a heat transfer apparatus including a heat distribution plate with a first surface being at least in part in thermal communication with the electronic device. The thermal conductivity of the heat distribution plate is higher in a direction substantially parallel to the first surface than in a direction perpendicular to the first surface.

Abstract: One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

Abstract: An integrated circuit assembly including an integrated circuit device electrically connected to a signal line, and method of making the same. The invention also includes a heat dissipation device thermally coupled to the integrated circuit device and a termination resistor electrically connected to the signal line and the heat dissipation device.

Abstract: A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a cooling element that is arranged on the surface of the board and includes first and second sections extending in a first direction. At least one stabilizing element that extends in the first direction is arranged at first and second ends of the first section of the cooling element. A surface of the first section of the cooling element is at a first distance from the surface of the board and a surface of the second section of the cooling element is at a second distance from the surface of the board, the first distance being different from the second distance.

Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

Abstract: A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.

Abstract: The present invention provides a method for connection of an integrated circuit (1), in particular of a chip, a wafer or a hybrid, to a substrate (10), which has the following steps: provision of an elastic intermediate layer (5) on the integrated circuit (1) and/or the substrate (10); structuring of the elastic layer (5) in raised areas (5a) and recessed areas (5b); and connection of the substrate (10) and of the integrated circuit (1) via the structured elastic intermediate layer (5). The invention likewise provides a corresponding circuit arrangement.

Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.