Patents by Inventor Anton Li

Anton Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240317940
    Abstract: There is provided a soluble polyimide resin comprising: (a) one or more tetracarboxylic acid component residues: (b) one or more diamine component residues; and (c) one or more endcapping compounds; wherein: the one or more endcapping compounds comprise one or more crosslinking groups. The soluble polyimide resin can be used in electronics applications.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Inventors: Nora Sabina Radu, Jaclyn Murphy, Chai Kit Ngai, Greg A. Hostetler, Qing Min Wang, Tao Huang, Anton Li, Tanya N. Singh-Rachford
  • Publication number: 20240317985
    Abstract: There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Inventors: Colin Hayes, Anton Chavez, Nora Sabina Radu, Jaclyn Murphy, Qing Min Wang, Tao Huang, Anton Li, Tanya N. Singh-Rachford, Michael Gallagher
  • Patent number: 11332559
    Abstract: Compositions for forming polymer layers useful in the manufacture of display devices, particularly flexible display, and methods of forming such devices are provided.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: May 17, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Yixuan Song, Lujia Bu, Neelima Chandrayan, Deyan Wang, Anton Li, Jieqian Zhang
  • Publication number: 20210017308
    Abstract: Compositions for forming polymer layers useful in the manufacture of display devices, particularly flexible display, and methods of forming such devices are provided.
    Type: Application
    Filed: June 23, 2020
    Publication date: January 21, 2021
    Inventors: Yixuan Song, Lujia Bu, Neelima Chandrayan, Deyan Wang, Anton Li, Jieqian Zhang
  • Publication number: 20180162967
    Abstract: Polyarylene oligomer compositions capable of curing at lower temperatures than conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.
    Type: Application
    Filed: October 18, 2017
    Publication date: June 14, 2018
    Inventors: Christopher Gilmore, Aaron A. Rachford, Jieqian Zhang, Ping Ding, Dong Eun Lee, Anton Li, Young-Seok Kim