Patents by Inventor Anton Max Linz

Anton Max Linz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RF body coil with acoustic isolation of conductors
    Patent number: 7671593
    Abstract: A system for isolating vibration and reducing acoustic noise in the RF coil of an MR imaging apparatus is presented. The system positions an RF conductor in its operative position proximate to an RF support form. The RF conductor is sandwiched between a vibration decoupling layer and a mass loading layer. The vibration decoupling layer is affixed to the RF support form so that the vibration decoupling layer is positioned between the RF conduit and the RF support form while the mass loading layer is located exterior of the RF conductor. By this arrangement, the acoustic energy is decoupled from the RF support form by the vibration decoupling layer while the vibration is reduced by the mass loading layer located exterior of the RF conductor.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: March 2, 2010
    Assignee: General Electric Company
    Inventors: David M. Goldhaber, Darren Lee Hallman, Anton Max Linz
  • RF BODY COIL WITH ACOUSTIC ISOLATION OF CONDUCTORS
    Publication number: 20070290686
    Abstract: A system for isolating vibration and reducing acoustic noise in the RF coil of an MR imaging apparatus is presented. The system positions an RF conductor in its operative position proximate to an RF support form. The RF conductor is sandwiched between a vibration decoupling layer and a mass loading layer. The vibration decoupling layer is affixed to the RF support form so that the vibration decoupling layer is positioned between the RF conduit and the RF support form while the mass loading layer is located exterior of the RF conductor. By this arrangement, the acoustic energy is decoupled from the RF support form by the vibration decoupling layer while the vibration is reduced by the mass loading layer located exterior of the RF conductor.
    Type: Application
    Filed: June 15, 2006
    Publication date: December 20, 2007
    Inventors: David M. Goldhaber, Darren Lee Hallman, Anton Max Linz