Patents by Inventor Anton MIRIC

Anton MIRIC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
    Publication number: 20200199029
    Abstract: One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.
    Type: Application
    Filed: June 21, 2018
    Publication date: June 25, 2020
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Anton Miric, Kai Herbst, Miriam Rauer, Christian Jung, Peter Dietrich
  • Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
    Patent number: 10622331
    Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 14, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas Hinrich, Susanne Duch, Anton Miric, Michael Schäfer, Christian Bachmann, Holger Ulrich, Frank Osterwald, David Benning, Jacek Rudzki, Lars Paulsen, Frank Schefuss, Martin Becker
  • THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS
    Publication number: 20190002359
    Abstract: Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.
    Type: Application
    Filed: December 21, 2016
    Publication date: January 3, 2019
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Paul GUNDEL, Anton MIRIC, Melanie BAWOHL, Gabriel ZIER, Kai HERBST
  • METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT, AND METHOD FOR CONNECTING A SUBSTRATE ARRANGEMENT TO AN ELECTRONIC COMPONENT
    Publication number: 20180286831
    Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.
    Type: Application
    Filed: September 28, 2016
    Publication date: October 4, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas HINRICH, Susanne DUCH, Anton MIRIC, Michael SCHÄFER