Abstract: An image sensor assembly and a method for assembling. The assembly includes: a ceramic package; at least one wall raised from the ceramic package, one of the walls for dividing a first surface region and a second surface region of the ceramic package; a frame supported by the ceramic package; a first set of fiducial markers and a second set of fiducial markers visible on the frame; a first die for placement onto the first surface region, the first die including an image sensor and respective fiducial markers for alignment with the first set of fiducial markers; a second die for placement onto the second surface region, the second die including an image sensor and respective fiducial markers for alignment with the second set of fiducial markers; and at least one optical filter each associated with one of the dice and supported by at least one of the walls.

Abstract: An X-ray detector is manufactured bonding detector layers onto a main frame leaving a protruding edge portion extending beyond edge of the detector layers. The protruding edge portion of the main frame is then detached from the main frame along a detachment line adjacent the edge of the detector layers before a cover with a thin edge wall is applied to the detector stack.

Abstract: An image sensor assembly and a method for assembling. The assembly includes: a ceramic package; at least one wall raised from the ceramic package, one of the walls for dividing a first surface region and a second surface region of the ceramic package; a frame supported by the ceramic package; a first set of fiducial markers and a second set of fiducial markers visible on the frame; a first die for placement onto the first surface region, the first die including an image sensor and respective fiducial markers for alignment with the first set of fiducial markers; a second die for placement onto the second surface region, the second die including an image sensor and respective fiducial markers for alignment with the second set of fiducial markers; and at least one optical filter each associated with one of the dice and supported by at least one of the walls.

Abstract: A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.

Abstract: A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.

Abstract: An X-ray detector is manufactured bonding detector layers onto a main frame leaving a protruding edge portion extending beyond edge of the detector layers. The protruding edge portion of the main frame is then detached from the main frame along a detachment line adjacent the edge of the detector layers before a cover with a thin edge wall is applied to the detector stack.

Abstract: Stand-offs are attached around the periphery of the fiber optic plate (FOP) to ensure a certain minimum thickness between the FOP and the imaging sensor to reduce shear stress and the risk of delamination due to shear stress in an X or Gamma ray detector. A coupling material fills the gap between the FOP and the imaging sensor.

Abstract: A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.

Abstract: A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.

Abstract: Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a “glob top” encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.

Abstract: Stand-offs are attached around the periphery of the fiber optic plate (FOP) to ensure a certain minimum thickness between the FOP and the imaging sensor to reduce shear stress and the risk of delamination due to shear stress in an X or Gamma ray detector. A coupling material fills the gap between the FOP and the imaging sensor.

Abstract: Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a “glob top” encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.

Abstract: A method of making a high resolution camera includes assembling, imaging and processing. The assembling includes assembling on a carrier a plurality of sensors. Each sensor is for imaging a portion of an object. The plurality of sensors are disposed so that the portions imaged by adjacent sensors overlap in a seam leaving no gaps between portions. The imaging images a predetermined known pattern to produce from the plurality of sensors a corresponding plurality of image data sets. The processing processes the plurality of image data sets to determine offset and rotation parameters for each sensor by exploiting overlapping seams.

Abstract: An assembly includes a first packaged device that contains a first image sensor having first fiducial marks thereon. On a portion of the first packaged device at a predetermined location relative to the first fiducial marks is adhesive, and a first connection body is fixed within the adhesive and registered at the predetermined location relative to the first fiducial marks. The first connection body is mated into the first counter hole formed in a plate at a predetermined location.

Abstract: A method of making a high resolution camera includes assembling, imaging and processing. The assembling includes assembling on a carrier a plurality of sensors. Each sensor is for imaging a portion of an object. The plurality of sensors are disposed so that the portions imaged by adjacent sensors overlap in a seam leaving no gaps between portions. The imaging images a predetermined known pattern to produce from the plurality of sensors a corresponding plurality of image data sets. The processing processes the plurality of image data sets to determine offset and rotation parameters for each sensor by exploiting overlapping seams.

Abstract: A method of making a high resolution wide format sensor for imaging a moving image conjugate includes assembling, imaging and processing. Plural sensors are assembled on a carrier. Each sensor images a strip portion of the moving image conjugate. The plural sensors are disposed so that strip portions imaged by adjacent sensors overlap in a seam leaving no gaps between strip portions. The carrier and the sensors have been fabricated out of materials with compatible coefficients of thermal expansion. A known pattern is imaged to produce from the sensors corresponding plural strip image data. The strip image data are processed to determine offset and rotation parameters for each sensor by exploiting overlapping seams.

Abstract: A method of sealing a package includes plating a perimeter of a hole formed in a package and attaching a solder film to the plated perimeter, the solder film covering the hole. The method further includes assembling a device in the package and sealing the package to define an interior and an outside, the device being contained within the interior. Next, the method includes heating the assembled package in a vacuum oven to a predetermined temperature where the solder film bonds to the plated perimeter, evacuating the vacuum oven to form a vacuum until the solder film fractures as a gas contained in the interior escapes to the outside, and further heating the assembled package in the vacuum oven after the gas in the interior escapes to the outside and until the solder film re-melts and seals over the hole.

Abstract: An assembly includes a first packaged device that contains a first image sensor having first fiducial marks thereon. On a portion of the first packaged device at a predetermined location relative to the first fiducial marks is adhesive, and a first connection body is fixed within the adhesive and registered at the predetermined location relative to the first fiducial marks. The first connection body is mated into the first counter hole formed in a plate at a predetermined location.

Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to a semiconductor device comprising a semiconductor body in which an image sensor is formed and having a semiconductor body surface with an optically active part of the image sensor and a non-optically active part of the image sensor in which electrical connection areas of the image sensor are located, a spacer structure being present on the semiconductor body surface in the non-optically active part of the image sensor and an optical passive component being positioned on top of the spacer structure and above the image sensor and allowing radiation to impinge on the optically active part of the image sensor. According to the invention the spacer structure is an open structure allowing the atmosphere above the optically active part of the image sensor to contact the atmosphere outside the spacer structure. The spacer structure may comprise a ring provided with at least one interruption and positioned around the optically active part of the image sensor.