Abstract: Systems, methods, and program products are provided for the calibration and scanning of multiple AFM probe heads used employed together for synchronous scanning. An automated calibration process is provided employing scan data from multiple AFM probe heads to automatically calibrate the system and position the probe heads at relative offset positions that are successively closer and more precise. Multiple heads are scanned simultaneously and synchronously to produce scan images, which are automatically evaluated to recognize a common feature. From this, a relative offset of the images is calculated and the true position of each probe tip may be known. Using this knowledge, a position offset is applied to bring the probe tips closer together at a desired spatial relationship. The techniques may be repeated at two or more levels varying from coarse to fine, and may be repeated after probing or movement to a new region of interest.

Abstract: Systems, methods, and program products are provided for the calibration and scanning of multiple AFM probe heads used employed together for synchronous scanning. An automated calibration process is provided employing scan data from multiple AFM probe heads to automatically calibrate the system and position the probe heads at relative offset positions that are successively closer and more precise. Multiple heads are scanned simultaneously and synchronously to produce scan images, which are automatically evaluated to recognize a common feature. From this, a relative offset of the images is calculated and the true position of each probe tip may be known. Using this knowledge, a position offset is applied to bring the probe tips closer together at a desired spatial relationship. The techniques may be repeated at two or more levels varying from coarse to fine, and may be repeated after probing or movement to a new region of interest.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.