Patents by Inventor Anton Talalayev

Anton Talalayev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9853402
    Abstract: An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: December 26, 2017
    Assignee: Apple Inc.
    Inventors: Anton Talalayev, David H. Narajowski, Christiaan A. Ligtenberg, Mahmoud R. Amini, William F. Leggett, Mikael M. Silvanto, Christopher J. Stringer, George Tziviskos, Edward Cooper, Ron Alan Hopkinson, Ari Parsons Miller
  • Patent number: 9787032
    Abstract: Ground springs for connector receptacles. The ground springs may protect circuitry in an electronic device from stray voltages when a connector insert is inserted into a connector receptacle housed in the electronic device. One example may have a contacting portion located such that when a connector insert is mated with the connector receptacle, the contacting portion of the ground spring electrically connects to a shield of the connector insert before a ground contact of the connector insert electrically connects to a signal contact on a tongue of the connector receptacle.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: October 10, 2017
    Assignee: Apple Inc.
    Inventors: Anton Talalayev, George Tziviskos, Kevin M. Robinson, Daniel A. Bergvall, Edward J. Cooper, Brett W. Degner, David H. Narajowski, Ari Miller, Houtan R. Farahani
  • Publication number: 20170093099
    Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.
    Type: Application
    Filed: May 10, 2016
    Publication date: March 30, 2017
    Applicant: Apple Inc.
    Inventors: Anton Talalayev, David H. Narajowski, Christiaan A. Ligtenberg, Mahmoud R. Amini, William F. Leggett, Mikael M. Silvanto, Christopher J. Stringer, George Tziviskos, Edward Cooper
  • Patent number: D717342
    Type: Grant
    Filed: June 9, 2013
    Date of Patent: November 11, 2014
    Assignee: Apple Inc.
    Inventors: Jon Berk, Matthew Phillip Casebolt, Brett Degner, Kevin Fetterman, Asif Iqbal, Richard Kosoglow, Christopher J. Stringer, Anton Talalayev, Eugene Antony Whang