Patents by Inventor Antonio B. Dimaanor, Jr.

Antonio B. Dimaanor, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package in package system
    Patent number: 8164172
    Abstract: An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: April 24, 2012
    Assignee: STATS ChipPAC Ltd.
    Inventors: Tsz Yin Ho, Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaanor, Jr., Heap Hoe Kuan