Abstract: A semiconductor device and method of manufacturing is provided, including a lead frame with a first and a second lead frame surface, a semiconductor die including a first and a second semiconductor die surface, a clip including a flat and a corrugated part, the corrugated part includes at least one peak and one valley, and a mold compound, the second lead frame surface is connected to the first die surface of the die, and the second die surface of the die is connected to the corrugated part, and the mold compound encapsulates the semiconductor die, and the valley of the corrugated part, so that the mold compound forms an outer surface of the device with the peak of the corrugated part, at least part of the flat part of the clip, and the first lead frame surface of the lead frame is exposed.

Abstract: A lead frame for connecting a semiconductor die to a base plate is provided. The lead frame includes: one or more lead portions, configured for connecting the lead frame to the base plate; a first contact element configured to be connected to a source of the semiconductor die; and a second contact element configured to be connected to a drain of the semiconductor die, the second contact element includes at least two contact portions that in an assembled state of the lead frame each contact the drain of the semiconductor die with a contact area thereof, the contact areas of the respective contact portions are spaced apart from each other.

Abstract: A semiconductor package that includes a substrate having first and second major surfaces is presented. The package includes a plurality of landing pads and a semiconductor die disposed on the first major surface. A molded cap is disposed on the first surface to encapsulate the die and substrate. The landing pads are covered when the cap is molded. Package interconnects are coupled to the landing pads. The package interconnects are exposed by the cap to facilitate package stacking.

Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.

Abstract: An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.

Abstract: An integrated circuit leaded stacked package system including forming an no-lead integrated circuit package having a mold cap, and attaching a mold cap of an extended-lead integrated circuit package facing the mold cap of the no-lead integrated circuit package.

Abstract: An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.

Abstract: An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.

Abstract: A stackable integrated circuit package system is provided placing a first integrated circuit die having an interconnect provided thereon in a substrate having a cavity, encapsulating the first integrated circuit die, having the interconnect exposed, in the cavity and along a first side of the substrate, mounting a second integrated circuit die to the first integrated circuit die, and encapsulating the second integrated circuit die along a second side of the substrate.

Abstract: A stackable integrated circuit package system is provided forming a first integrated circuit die having an interconnect provided thereon, forming an external interconnect, having an upper tip and a lower tip, from a lead frame, mounting the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip, and encapsulating around the interconnect with an exposed surface.

Abstract: An integrated circuit package system is provided including an integrated circuit package system including an integrated circuit and a lead frame. The lead frame has a multi-surface die attach pad and the integrated circuit is mounted to the multi-surface die attach pad.

Abstract: A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.

Abstract: A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are enclosed in an encapsulant.

Abstract: A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.

Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.

Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.

Abstract: A design and method of fabrication for a semiconductor package is described. A solder bumped semiconductor chip is assembled to a metallized package substrate utilizing the solder bumps. The interconnecting solder bumps are properly constrained at assembly by the introduction of a no-flow underfill between the chip and the substrate. The no-flow underfill constrains the solder of the solder bumps so as to maintain the desired size and shape.

Abstract: A semiconductor chip packaging structure is described. The structure comprising of a semiconductor chip interconnected to a recessed lead frame and the resultant assembly encapsulated in a molding compound. The final product is a reverse mounted semiconductor chip in a leadless quad flat pack configuration. A second embodiment allows for the semiconductor chip backside to be exposed for thermal enhancements. Manufacturing methods are also described for the two embodiments disclosed.

Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is.

Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is.