Patents by Inventor Antonio DIMAANO, JR.

Antonio DIMAANO, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
    Publication number: 20090236726
    Abstract: A semiconductor package that includes a substrate having first and second major surfaces is presented. The package includes a plurality of landing pads and a semiconductor die disposed on the first major surface. A molded cap is disposed on the first surface to encapsulate the die and substrate. The landing pads are covered when the cap is molded. Package interconnects are coupled to the landing pads. The package interconnects are exposed by the cap to facilitate package stacking.
    Type: Application
    Filed: December 12, 2008
    Publication date: September 24, 2009
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Danny RETUTA, Hien Boon TAN, Yi Sheng Anthony SUN, Librado Amurao GATBONTON, Antonio DIMAANO, JR.