Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Abstract: A removable handle for use in handling semi-conductor wafer processing cassettes includes a horizontally extending front coupling bar with coupling channels on each end for engaging flanges on the cassette. A handle includes a body portion which is mountable to and extends transversely from the coupling bar. A grip portion extends angularly from the body and is furnished with contoured finger portions. The grip includes a finger trigger for actuating a spring biased resilient plunger mechanism to engage the sidewall of the cassette and secure it to the coupling bar. The grip also includes a thumb latch for releasing the plunger mechanism, in resonse to the spring bias, and allowing the handle to be disengaged from the cassette.