Patents by Inventor Antonio Espinoza

Antonio Espinoza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for reduced delamination of an integrated circuit module
    Patent number: 8274162
    Abstract: An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
    Type: Grant
    Filed: January 20, 2007
    Date of Patent: September 25, 2012
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Dean L. Monthei, Antonio Espinoza, Waldemar J. Holgado
  • Apparatus and method for reduced delamination of an integrated circuit module
    Publication number: 20080174003
    Abstract: An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
    Type: Application
    Filed: January 20, 2007
    Publication date: July 24, 2008
    Inventors: Dean L. Monthei, Antonio Espinoza, Waldemar J. Holgado