Patents by Inventor Antonio Grasso

Antonio Grasso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for automating ETL application
    Patent number: 8024369
    Abstract: Novel tools for development and operation of ETL (Extract Transform Load) systems for populating databases. An embodiment uses metadata tables to describe relationships between jobs to run for processing data. These relationships can include parent-child job relation, and priority. These tools create a DataStage Service Architecture (DSA) that helps automate and control the ETL process. Other tools allow developers to easily view and update the ETL process.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: September 20, 2011
    Assignee: Accenture Global Services Limited
    Inventors: Paolo Pellegrini, Antonio Grasso
  • SYSTEM AND METHOD FOR AUTOMATING ETL APPLICATION
    Publication number: 20090177671
    Abstract: Novel tools for development and operation of ETL (Extract Transform Load) systems for populating databases. An embodiment uses metadata tables to describe relationships between jobs to run for processing data. These relationships can include parent-child job relation, and priority. These tools create a DataStage Service Architecture (DSA) that helps automate and control the ETL process. Other tools allow developers to easily view and update the ETL process.
    Type: Application
    Filed: March 28, 2008
    Publication date: July 9, 2009
    Applicant: ACCENTURE GLOBAL SERVICES GMBH
    Inventors: PAOLO PELLEGRINI, Antonio Grasso
  • Method for the soldering of semiconductor chips on supports of not-noble metal
    Patent number: 4615478
    Abstract: After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570.degree. C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.
    Type: Grant
    Filed: June 10, 1983
    Date of Patent: October 7, 1986
    Assignee: SGS-ATES Componenti Elettronici S.p.A.
    Inventors: Luciano Gandolfi, Antonio Grasso, Antonio Perniciaro