Patents by Inventor Antonio LANDI

Antonio LANDI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Back side contact structure for a semiconductor device and corresponding manufacturing process
    Patent number: 11894432
    Abstract: Various embodiments provide a vertical-conduction semiconductor device that includes: a silicon substrate having a front face and a rear face; a front-side structure arranged on the front face of the substrate, having at least one current-conduction region at the front face; and a back side metal structure, arranged on the rear face of the substrate, in electrical contact with the substrate and constituted by a stack of metal layers. The back side metal structure is formed by: a first metal layer; a silicide region, interposed between the rear face of the substrate and the first metal layer and in electrical contact with the aforesaid rear face; and a second metal layer arranged on the first metal layer.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: February 6, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Crocifisso Marco Antonio Renna, Antonio Landi, Brunella Cafra
  • BACK SIDE CONTACT STRUCTURE FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
    Publication number: 20220246735
    Abstract: Various embodiments provide a vertical-conduction semiconductor device that includes: a silicon substrate having a front face and a rear face; a front-side structure arranged on the front face of the substrate, having at least one current-conduction region at the front face; and a back side metal structure, arranged on the rear face of the substrate, in electrical contact with the substrate and constituted by a stack of metal layers. The back side metal structure is formed by: a first metal layer; a silicide region, interposed between the rear face of the substrate and the first metal layer and in electrical contact with the aforesaid rear face; and a second metal layer arranged on the first metal layer.
    Type: Application
    Filed: January 11, 2022
    Publication date: August 4, 2022
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Crocifisso Marco Antonio RENNA, Antonio LANDI, Brunella CAFRA