Abstract: The present invention relates to thermoforming food packaging methods and to dual ovenable thermoformed food packages suitable for cooking food products directly in the package in microwave, conventional and convection ovens. These packages are characterized by good hermeticity, clean peelability, self-venting, very good optics and, if shrunk, a very appealing appearance.

Abstract: A product can be packaged by arranging the product on a support, providing a plastic film above the support with the product arranged between the support and the film sheet, and air tightly fixing the film to the support. The process can be implemented using an apparatus that includes a film supply assembly and a base equipment having an upper side defining one or more receiving areas, each being configured for receiving a respective product loaded support; an upper tool is configured for holding a film portion above the product loaded support and then heat sealing the film portion to the product loaded support. Each receiving area has a flat portion and elongated features protruding above the plane of flat portion.

Abstract: It is disclosed a process of packaging of product arranged on a support comprising providing a plastic film above said support with said product being arranged between the support and the film sheet, and air tightly fixing said film to said support. The process is implemented using an apparatus for packaging comprising a film supply assembly and a base equipment having an upper side defining one or more receiving areas, each one of the receiving areas being configured for receiving at least one respective product loaded support; an upper tool is configured for holding a film portion above the product loaded support and then heat sealing the film portion to the product loaded support. Each receiving area has a flat portion and elongated features protruding above the plane of flat portion. It is also disclosed a packaged product obtainable with said process and apparatus.

Abstract: A process and apparatus can be used to vacuum skin package a product arranged on a support comprising providing a film portion above said support with the product being arranged between the support and the film portion; air tightly fixing the film portion to the support; removing at least a portion of air from a volume underneath said film portion through said at one nozzle inserted in an interspace between the film portion and the support.

Abstract: The present invention relates to thermoforming food packaging methods and to dual ovenable thermoformed food packages suitable for cooking food products directly in the package in microwave, conventional and convection ovens. These packages are characterized by good hermeticity, clean peelability, self-venting, very good optics and, if shrunk, a very appealing appearance.

Abstract: The present invention relates to the use of dual ovenable biaxially oriented polyester films in vacuum skin packaging applications. Furthermore, the invention relates to preferably dual ovenable skin packages, in particular to preferably dual ovenable vacuum skin food packages for cook-in applications. Due to the very high formability, the VSP packages of the present invention do not show the defects of prior VSP ovenable packages such as self-sealing of the top web or unsealed areas around the packed product.

Abstract: A process and apparatus can be used to vacuum skin package a product arranged on a support comprising providing a film portion above said support with the product being arranged between the support and the film portion; air tightly fixing the film portion to the support; removing at least a portion of air from a volume underneath said film portion through said at one nozzle inserted in an interspace between the film portion and the support.