Patents by Inventor Antonio Maria Rinaldi

Antonio Maria Rinaldi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for dressing a wafer polishing pad
    Patent number: 7846007
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Dressing a wafer polishing pad
    Patent number: 7846006
    Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD
    Publication number: 20090176441
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Application
    Filed: January 9, 2009
    Publication date: July 9, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery