Patents by Inventor Antonio P. Spatrisano

Antonio P. Spatrisano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a modular semiconductor power device
    Patent number: 4926547
    Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.
    Type: Grant
    Filed: June 27, 1989
    Date of Patent: May 22, 1990
    Assignee: SGS-Thomson Microelectronics S.p.A.
    Inventors: Antonio P. Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina
  • Method for manufacturing a modular semiconductor power device
    Patent number: RE37416
    Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: October 23, 2001
    Assignee: STMicroelectronics S.r.l.
    Inventors: Antonio P. Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina