Abstract: Moulding composition comprising from 10 to 50% by weight of a mixture of a first polyester obtained by polycondensation of an alkylene glycol with maleic and/or fumaric acid and a second polyester obtained by polycondensation of an alkylene glycol with an aromatic dicarboxylic acid or a mixture thereof with maleic and/or fumaric acid, the first polyester being present in an amount of from 5 to 50 parts by weight for each 100 parts by weight of the sum of the first and second polyesters, from 0.2 to 2% by weight of an organic peroxide having a decomposition temperature above 70.degree. C., and one or more inert fillers.The composition can be formed into free-flowing granules, free from a tendency to agglomerate, and can be moulded by injection moulding like thermoplastic materials.

Abstract: A granular thermosetting composition free from a tendency to release dust and transformable into molded articles free from surface defects, is obtained by forming the composition into granules of from 2 to 8 mm in size and mixing said granules with from 0.5 to 3 wt.% of one or more substances, in liquid form, chosen from acetone, phenol, aniline and reaction products of phenol with styrene.

Abstract: A thermosetting molding composition comprising from 15 to 50 wt.% of Novolak phenolic resin; from 3 to 10 wt.% of hexamine; from 1 to 4 wt.% of a stabilizing-catalyzing mixture consisting of an amine chosen from polyamino aliphatic compounds and mono or polyamino aromatic compounds, and orthoboric or metaboric acid, wherein the ratio between said amino groups and the number of acid equivalents in said mixture is from 0.001:1 to 0.3:1; from 0.5 to 2 wt.% of alkaline earth metal oxide; and one or more inert fillers. This composition is particularly suitable for the production of molded articles by injection molding.

Abstract: Molding composition comprising from 10 to 50 wt.% of the polycondensation product of an alkylene glycol or a mixture of the latter with up to 20 wt.% of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof, with an ethylenically unsaturated dicarboxylic acid and a saturated dicaboxylic acid, having a melting point of at least 60.degree. C, an acid value of less than 50 and a Gardner viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70.degree. C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields.

Abstract: Molding composition comprising an inert filler, from 0.2 to 2 wt.% of an organic peroxide with a decomposition temperature above 70.degree. C, from 0.5 to 10 wt.% of an amide of an unsaturated aliphatic carboxylic acid, and from 10 to 50 wt.% of unsaturated polyester A and/or unsaturated polyester B, wherein said polyester A is the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof with an unsaturated dicarboxylic acid, and said polyester B is the polycondensation product of an alkylene glycol with an unsaturated dicarboxylic acid and a saturated dicarboxylic acid.The resulting molded articles are particularly useful in the electrical and electronic fields.

Abstract: Molding composition comprising from 10 to 50 wt.% of the polycondensation product of 2,2'-bis(4-hydroxycyclohexyl) propane or a halogenated derivative thereof, and maleic or fumaric acid, having a melting point above 70.degree. C, an acid value of less than 50 and a Gardener viscosity from Y to Z.sub.3, from 0.2 to 2 wt.% of an organic peroxide which decomposes at a temperature above 70.degree. C, and an inert filler.The resulting molded articles are particularly useful in the electrical and electronic fields.