Patents by Inventor Antonio Perniciaro

Antonio Perniciaro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular semiconductor power device
    Patent number: 5038198
    Abstract: A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
    Type: Grant
    Filed: January 9, 1990
    Date of Patent: August 6, 1991
    Assignee: SGS-Thomson Microelectronics S.p.A.
    Inventors: Antonio Perniciaro Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina
  • Method for the soldering of semiconductor chips on supports of not-noble metal
    Patent number: 4615478
    Abstract: After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570.degree. C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.
    Type: Grant
    Filed: June 10, 1983
    Date of Patent: October 7, 1986
    Assignee: SGS-ATES Componenti Elettronici S.p.A.
    Inventors: Luciano Gandolfi, Antonio Grasso, Antonio Perniciaro
  • Modular semiconductor power device
    Patent number: RE38037
    Abstract: A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: March 18, 2003
    Assignee: STMicroelectronics S.r.l.
    Inventors: Antonio Perniciaro Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina