Abstract: Subject-matter of the present invention is a composition suitable for the preparation of food products essentially intended for subjects with swallowing difficulty and/or malnourished subjects. Further subject-matter of the invention is a process for the preparation of such food products and the so-prepared food products.

Abstract: A system, method, and silicon chip package for providing connections between a die of a silicon chip package and external leads of the silicon chip package is disclosed. The connections are formed using a pre-mold etched with a trace pattern. The trace pattern provides rigid traces that connect the die with the external leads.

Abstract: A system, method, and silicon chip package for providing connections between a die of a silicon chip package and external leads of the silicon chip package is disclosed. The connections are formed using a pre-mold etched with a trace pattern. The trace pattern provides rigid traces that connect the die with the external leads.

Abstract: A system, method, and silicon chip package for providing connections between a die of a silicon chip package and external leads of the silicon chip package is disclosed. The connections are formed using a pre-mold etched with a trace pattern. The trace pattern provides rigid traces that connect the die with the external leads.

Abstract: One embodiment of the present invention includes a method for aligning a wafermap with a semiconductor wafer. The method may comprise assigning a location code to each of a plurality of dies on the wafermap. Each of the plurality of dies on the wafermap can correspond to each of a plurality of dies on the semiconductor wafer. The method may also comprise scanning an approximate location of a reference die on the semiconductor wafer with a die detection sensor based on the location code corresponding to a location of the reference die on the wafermap and determining a physical location of the reference die on the semiconductor wafer using the die detection sensor. The method may further comprise correlating the physical location of the reference die on the semiconductor wafer with the respective location code corresponding to the reference die on the wafermap.

Abstract: A waist pack includes a sleeve for removably retaining a bottle or other container. In accordance with various preferred aspects of the invention, the pack includes a sleeve configured to securely retain the bottle while at the same time allowing for convenient removal and replacement.

Abstract: A toothpaste dispensing apparatus 10 including a housing unit 11, dimensioned to slidably receive a dispensing unit 12 having a pair of roller elements 41, 42 engageable with the sealed end 101 of the toothpaste tube 100 and further including a closure unit 13 hingedly connected to the housing unit 11 and adapted to arrest the flow of toothpaste from the mouth 102 of the tube 100 which is engaged in a plate element 46 slidably disposed within the housing unit 11. The closure unit 13 cooperates with the dispensing unit 12 to provide a double seal arrangement to maintain the contents of the toothpaste tube 100.

Abstract: A contact fever thermometer adapted to be applied to a patient's skin to visually indicate the patient's temperature comprising a substantially rigid substrate having adhesive applied to one face thereof for adhering the substrate to the skin. The substrate is so sized that when the rigid substrate is adhered to the skin, the skin conforms generally to the shape of the substrate.

Abstract: A device for indicating ambient or room temperature in which the representation of the ambient or room temperature is in terms of specific colors and or shapes incorporated in a picture, instead of the usual digital or numeric way. It consists of a painting or picture with an overlay or painted-on-layer of liquid crystals which serve to cause the picture to change color and or shape in a predetermined way, in relation to specific ambient. Thus, ambient is pictorially depicted and described by this device, instead of the usual digital or numeric and quantitative manner.The picture upon which the liquid crystals are to be applied on are of dark or black background so that when the temperature is low, relative to the range of temperatures covered by the change of color of the liquid crystals, the unmodified color or and shape of the picture is shown.