Abstract: A Near Field Communication (NFC) device, includes: a device support body comprising at least one antenna coil, an integrated circuit coupled to the at least one antenna coil; and a photoresistive circuit coupled to the at least one antenna coil and comprising a photo-resistance, the photoresistive circuit being configured to increase a resistance of the at least one antenna coil when the at least one photo-resistance is in its high resistance state in a dark condition.

Abstract: A Near Field Communication (NFC) device, includes: a device support body comprising at least one antenna coil, an integrated circuit coupled to the at least one antenna coil; and a photoresistive circuit coupled to the at least one antenna coil and comprising a photo-resistance, the photoresistive circuit being configured to increase a resistance of the at least one antenna coil when the at least one photo-resistance is in its high resistance state in a dark condition.

Abstract: An integrated circuit card includes a substrate and an integrated circuit carried by the substrate. A first sector is delimited by a first weakening line on the substrate, with the first sector being able to be separated from the substrate. A second sector is delimited by a second weakening line inside the first sector, with the second sector being able to be separated from the substrate and having the integrated circuit thereon. A disposable frame-piece is defined between the first and second weakening lines of the first and second sectors, and has a ring form. A breakage lug is arranged with respect to the disposable frame-piece to break the disposable frame-piece so that it is no longer intact, during separation of the second sector from the substrate.

Abstract: An IC card may include a substrate having opposing first and second surfaces, and a circuit carried by the substrate adjacent the first surface of the substrate. The substrate may include a first area defining a first sector of the substrate carrying the circuit and configured to be separated from the IC card, the first sector having a form and size based upon a first IC card format, the first area having a first line delimiting the first sector to the first IC card format. The substrate may include a second area defining a second sector around the first sector and configured to be separated from the IC card based upon a second line. The second sector may have a form and size based upon at least one of a second IC card format and a third IC card format.

Abstract: An integrated circuit card includes a substrate and an integrated circuit carried by the substrate. A first sector is delimited by a first weakening line on the substrate, with the first sector being able to be separated from the substrate. A second sector is delimited by a second weakening line inside the first sector, with the second sector being able to be separated from the substrate and having the integrated circuit thereon. A disposable frame-piece is defined between the first and second weakening lines of the first and second sectors, and has a ring form. A breakage lug is arranged with respect to the disposable frame-piece to break the disposable frame-piece so that it is no longer intact, during separation of the second sector from the substrate.

Abstract: An IC card may include a substrate having opposing first and second surfaces, and a circuit carried by the substrate adjacent the first surface of the substrate. The substrate may include a first area defining a first sector of the substrate carrying the circuit and configured to be separated from the IC card, the first sector having a form and size based upon a first IC card format, the first area having a first line delimiting the first sector to the first IC card format. The substrate may include a second area defining a second sector around the first sector and configured to be separated from the IC card based upon a second line. The second sector may have a form and size based upon at least one of a second IC card format and a third IC card format.