Patents by Inventor Antonio Trizzino

Antonio Trizzino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glass and melt solder for the passivation of semiconductor components
    Patent number: 11926565
    Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
    Type: Grant
    Filed: March 21, 2023
    Date of Patent: March 12, 2024
    Assignee: SCHOTT AG
    Inventors: Linda Johanna Bartelt, Antonio Trizzino, Julia Gold, Sabine Pichler-Wilhelm, Martin Letz, Martun Hovhannisyan
  • GLASS AND MELT SOLDER FOR THE PASSIVATION OF SEMICONDUCTOR COMPONENTS
    Publication number: 20230219839
    Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
    Type: Application
    Filed: March 21, 2023
    Publication date: July 13, 2023
    Applicant: SCHOTT AG
    Inventors: Linda Johanna Bartelt, Antonio Trizzino, Julia Gold, Sabine Pichler-Wilhelm, Martin Letz, Martun Hovhannisyan
  • Glass and melt solder for the passivation of semiconductor components
    Patent number: 11634356
    Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: April 25, 2023
    Assignee: SCHOTT AG
    Inventors: Linda Johanna Bartelt, Antonio Trizzino, Julia Gold, Sabine Pichler-Wilhelm, Martin Letz, Martun Hovhannisyan
  • GLASS AND MELT SOLDER FOR THE PASSIVATION OF SEMICONDUCTOR COMPONENTS
    Publication number: 20210284569
    Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 16, 2021
    Inventors: Linda Johanna Bartelt, Antonio Trizzino, Julia Gold, Sabine Pichler-Wilhelm, Martin Letz, Martun Hovhannisyan