Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

Abstract: The present invention belongs to the field of biomedical chemistry and provides modified peptides and dimers thereof derived from the amino acid sequence of the protein ADAM-12, their compositions, process of synthesis and their use in medicine, specifically in the inhibition of cancer growth and/or the reduction or inhibition of cancer cell invasion and metastasis in different cancers.

Abstract: Embodiments described herein are generally directed to improving performance of high-performance computing (HPC) or artificial intelligence (AI) workloads on cluster computer systems. According to one embodiment, a section of a high-performance computing (HPC) or artificial intelligence (AI) workload executing on a cluster computer system is identified as significant to a figure of merit (FOM) of the workload. An alternate placement among multiple heterogeneous compute resources of a node of the cluster computer system is determined for a portion of the section currently executing on a given compute resource of the multiple heterogeneous compute resources. After predicting an improvement to the FOM based on the alternate placement, the portion is relocated to the alternate placement.

Abstract: A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.

Abstract: A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.

Abstract: A half bridge gate driving circuit for providing gate driving circuits in a bi-hecto celcius (200 degrees celcius) operating environment having multiple functions including combinations of multiple level logic inputs, noise immunity, fault protection, overlap protection, pulse modulation, high-frequency modulation with transformer based isolation, high-frequency demodulation back to pulse width modulation, deadtime generator, level shifter for high side transistor, overcurrent protection, and undervoltage lockout.

Abstract: A half bridge gate driving circuit for providing gate driving circuits in a bi-hecto celcius (200 degrees celcius) operating environment having multiple functions including combinations of multiple level logic inputs, noise immunity, fault protection, overlap protection, pulse modulation, high-frequency modulation with transformer based isolation, high-frequency demodulation back to pulse width modulation, deadtime generator, level shifter for high side transistor, overcurrent protection, and undervoltage lockout.

Abstract: An athletic glove with an integral weight system is herein disclosed, comprising a plurality of pockets on the back of the glove which holds either sand or metal shot to add weight. The amount of weight will vary per glove model, but is envisioned to be approximately three (3) to five (5) pounds per glove, depending on user preference. The glove is secured around a wrist during use by a hook-and-loop fastener. The glove with the integral weight system is intended to strengthen the hand, arm and upper body areas during workouts, exercise or everyday activities. The glove is expected to be introduced in both right-hand and left-hand configurations and to be presented as a pair.

Abstract: A method and a plant for filling a hydraulic circuit with a control fluid, in which a vacuum is generated within the hydraulic circuit, the control fluid is supplied to a degasification chamber, a vacuum is generated in the degasification chamber containing the control fluid and the control fluid is supplied under pressure from the degasification chamber to the hydraulic circuit while continuing to maintain the vacuum in the hydraulic circuit.