Patents by Inventor Antonio Voci
Antonio Voci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240059943Abstract: Heat-curing epoxy resin compositions containing a curing agent in the form of a mixture of aromatic dicarboxylic dihydrazide with a dihydrazide chosen from the group consisting of glutaric dihydrazide, adipic dihydrazide, pimelic dihydrazide, 8,12-eicosadienedioic acid-1,20-dihydrazide and 4-isopropyl-2,5-dioxoimidazolidine-1,3-di(propionohydrazide). The epoxy resin compositions are particularly suitable for automotive body-in-white bonding, where after induction pre-curing without additional metal joining techniques the pre-cured adhesives are cured again in a further step at temperatures of around 180° C.Type: ApplicationFiled: March 22, 2022Publication date: February 22, 2024Applicant: SIKA TECHNOLOGY AGInventors: Dusko PARIPOVIC, Dominique GALLO, Antonio VOCI
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Publication number: 20230312855Abstract: A pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder and at least one alkali metal salt of a fatty acid containing 16 C-atoms or 18 C-atoms, wherein the alkali metal is calcium or zinc. These pumpable filler materials provide the advantage that they can be expanded to provide foam with high expansion values after humidity exposure/storage. Further described are methods for filling closed spaces with the pumpable thermally foaming filler composition as well as vehicle parts which are obtainable with the indicated methods.Type: ApplicationFiled: September 29, 2021Publication date: October 5, 2023Applicant: SIKA TECHNOLOGY AGInventors: Antonio VOCI, Sara HALTINER, Carl Philipp ROSENAU
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Patent number: 11359119Abstract: A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH2)x?—OH the value of x?=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH2)y?—COOH and derivatives of dicarboxylic acid, value of y?=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.Type: GrantFiled: June 22, 2018Date of Patent: June 14, 2022Assignee: SIKA TECHNOLOGY AGInventors: Noah Munzinger, Antonio Voci, Urs Rheinegger
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Patent number: 11326081Abstract: A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH2)x?—OH the value of x?=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH2)y?—COOH and derivatives of dicarboxylic acid, value of y?=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.Type: GrantFiled: June 22, 2018Date of Patent: May 10, 2022Assignee: SIKA TECHNOLOGY AGInventors: Noah Munzinger, Antonio Voci, Urs Rheinegger
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Patent number: 11279796Abstract: A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.Type: GrantFiled: May 29, 2018Date of Patent: March 22, 2022Assignee: SIKA TECHNOLOGY AGInventors: Antonio Voci, Michael Gutgsell, Christian Eyholzer
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Patent number: 11208580Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.Type: GrantFiled: July 9, 2018Date of Patent: December 28, 2021Assignee: SIKA TECHNOLOGY AGInventor: Antonio Voci
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Publication number: 20210147731Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.Type: ApplicationFiled: July 9, 2018Publication date: May 20, 2021Applicant: SIKA TECHNOLOGY AGInventor: Antonio VOCI
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Publication number: 20200190252Abstract: A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.Type: ApplicationFiled: May 29, 2018Publication date: June 18, 2020Applicant: SIKA TECHNOLOGY AGInventors: Antonio VOCI, Michael GUTGSELL, Christian EYHOLZER
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Publication number: 20200181464Abstract: A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH2)x?—OH the value of x?=2-10, and—at least one dicarboxylic acid having structure HOOC—(CH2)y?—COOH and derivatives of dicarboxylic acid, value of y?=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.Type: ApplicationFiled: June 22, 2018Publication date: June 11, 2020Applicant: SIKA TECHNOLOGY AGInventors: Noah MUNZINGER, Antonio VOCI, Urs RHEINEGGER
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Patent number: 9512341Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.Type: GrantFiled: December 19, 2011Date of Patent: December 6, 2016Assignee: SIKA TECHNOLOGY AGInventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
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Publication number: 20130280536Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.Type: ApplicationFiled: December 19, 2011Publication date: October 24, 2013Applicant: SIKA TECHNOLOGY AGInventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
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Publication number: 20130280526Abstract: The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint.Type: ApplicationFiled: December 19, 2011Publication date: October 24, 2013Applicant: SIKA TECHNOLOGY AGInventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt