Abstract: Methods and apparatus are described in which, at design-time a thorough analysis and exploration is performed to represent a multi-objective “optimal” trade-off point or points, e.g. on Pareto curves, for the relevant cost (C) and constraint criteria. More formally, the trade-off points may e.g. be positions on a hyper-surface in an N-dimensional Pareto search space. The axes represent the relevant cost (C), quality cost (Q) and restriction (R) criteria. Each of these working points is determined by positions for the system operation (determined during the design-time mapping) for a selected set of decision knobs (e.g. the way data are organized in a memory hierarchy). The C-Q-R values are determined based on design-time models that then have to be “average-case” values in order to avoid a too worst-case characterization. At processing time, first a run-time BIST manager performs a functional correctness test, i.e. checks all the modules based on stored self-test sequences and “equivalence checker” hardware.

Abstract: First several possible working points are stored with different mappings to available modules. Each of these working points involves different trade-offs for important criteria related to performance and costs. At the design stage, these trade-off points for the criteria are not calibrated to the actual run-time conditions. Subsequently, based on actual values of the leakage criteria caused by temperature variations and/or ageing at given run-time conditions for (a subset of) the working points, it is possible to calibrate the trade-off curves and use a run-time controller to select the most suited working points afterward for an actual circuit. These active working points are selected to just meet the necessary system requirements on performance, while minimizing any of the important cost parameters.

Abstract: One inventive aspect relates to a method of determining an estimate of system-level yield loss for an electronic system comprising individual components subject to manufacturing process variability leading to manufacturing defects. The method comprises obtaining a description of the composition of the electronic system in terms of which individual components are used. The method further comprises obtaining statistical properties of the performance of individual components of the electronic system with respect to first and second performance variables, e.g. energy consumption and delay, the statistical properties including correlation information of the first and second performance variables. The method further comprises obtaining information about execution of an application on the system, e.g. a number of accesses of a component by an application.

Abstract: The present invention provides a driver circuit for driving a line terminated by a load, wherein said driver circuit is configurable for design time selected energy/delay working points. The configuration capability is used, e.g. during run-time, for dynamically selecting a suitable energy/delay working point, given the circumstances wherein said driver circuit has to operate. The driver circuit is in particular targeted for on-chip communication, but is not limited thereto.

Abstract: One inventive aspect relates to a method of determining an estimate of system-level yield loss for an electronic system comprising individual components subject to manufacturing process variability leading to manufacturing defects. The method comprises obtaining a description of the composition of the electronic system in terms of which individual components are used. The method further comprises obtaining statistical properties of the performance of individual components of the electronic system with respect to first and second performance variables, e.g. energy consumption and delay, the statistical properties including correlation information of the first and second performance variables. The method further comprises obtaining information about execution of an application on the system, e.g. a number of accesses of a component by an application.

Abstract: An aspect of the present invention provides a design environment in which a floorplan of a semiconductor device is optimised by taking into account activation or access frequency information to and from resources. Since segmented bus architecture is also a good alternative approach for the power consumption of the network, the floorplanning approach for energy optimization of the communicating network is adapted for such architectures in embodiments of the present invention. The provided method comprises both architecture optimizations as well as physical design optimizations.

Abstract: First several possible working points are stored with different mappings to available modules. Each of these working points involves different trade-offs for important criteria related to performance and costs. At the design stage, these trade-off points for the criteria are not calibrated to the actual run-time conditions. Subsequently, based on actual values of the leakage criteria caused by temperature variations and/or ageing at given run-time conditions for (a subset of) the working points, it is possible to calibrate the trade-off curves and use a run-time controller to select the most suited working points afterward for an actual circuit. These active working points are selected to just meet the necessary system requirements on performance, while minimizing any of the important cost parameters.

Abstract: The present invention relates to the design of essentially digital systems and components. In one embodiment, a parameterized model of a sub-component of an essentially digital system is provided. This sub-component is used in components of the system, e.g. interconnect at the different levels (up to the packaging level) and includes all relevant parameters with their physical constraints. If certain parameters do not play a significant role at the system level exploration, they can be left out of the exploration. But then they should preferably be fixed on the value that allows the cheapest and most reliable process technology solutions (independent of their delay or energy consequences). For the parameters that do have a large impact, the subranges of their trade-off curves, especially Pareto curves, that are appropriate for a given target domain (e.g. ambient multimedia) should be carefully selected to match design cost, process cost and reliability issues.

Abstract: The present invention provides a driver circuit for driving a line terminated by a load, wherein said driver circuit is configurable for design time selected energy/delay working points. The configuration capability is used, e.g. during run-time, for dynamically selecting a suitable energy/delay working point, given the circumstances wherein said driver circuit has to operate. The driver circuit is in particular targeted for on-chip communication, but is not limited thereto.

Abstract: Methods and apparatus are described in which, at design-time a thorough analysis and exploration is performed to represent a multi-objective “optimal” trade-off point or points, e.g. on Pareto curves, for the relevant cost (C) and constraint criteria. More formally, the trade-off points may e.g. be positions on a hyper-surface in an N-dimensional Pareto search space. The axes represent the relevant cost (C), quality cost (Q) and restriction (R) criteria. Each of these working points is determined by positions for the system operation (determined during the design-time mapping) for a selected set of decision knobs (e.g. the way data are organized in a memory hierarchy). The C-Q-R values are determined based on design-time models that then have to be “average-case” values in order to avoid a too worst-case characterisation. At processing time, first a run-time BIST manager performs a functional correctness test, i.e. checks all the modules based on stored self-test sequences and “equivalence checker” hardware.

Abstract: An aspect of the present invention provides a design environment in which a floorplan of a semiconductor device is optimised by taking into account activation or access frequency information to and from resources. Since segmented bus architecture is also a good alternative approach for the power consumption of the network, the floorplanning approach for energy optimization of the communicating network is adapted for such architectures in embodiments of the present invention. The provided method comprises both architecture optimizations as well as physical design optimizations.

Abstract: The present invention relates to the design of essentially digital systems and components. In one embodiment, a parameterized model of a sub-component of an essentially digital system is provided. This sub-component is used in components of the system, e.g. interconnect at the different levels (up to the packaging level) and includes all relevant parameters with their physical constraints. If certain parameters do not play a significant role at the system level exploration, they can be left out of the exploration. But then they should preferably be fixed on the value that allows the cheapest and most reliable process technology solutions (independent of their delay or energy consequences). For the parameters that do have a large impact, the subranges of their trade-off curves, especially Pareto curves, that are appropriate for a given target domain (e.g. ambient multimedia) should be carefully selected to match design cost, process cost and reliability issues.