Abstract: An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

Abstract: An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

Abstract: The invention relates to a method for dicing a substrate with a laser apparatus, comprising the steps of delivering a laser beam (15) from said laser apparatus to said substrate to dice said substrate (1) in at least two dies. A first assist gas is supplied at the substrate during a first phase of said dicing method and a second assist gas is supplied at the substrate during a second subsequent phase of said dicing method. The method results in a reduced street-width for dicing of the substrate and consequently costly substrate area is saved. The invention also relates to a laser dicing system, a computer program product for executing the method and a silicon die obtainable by the method.

Abstract: A vacuum cleaner is provided that is adapted to detect and display and/or avoid obstacles. In such vacuum cleaners the driving wheels and/or castor wheels that determine the direction of travel may be actively controlled to achieve, at the point in time of obstacle touch or obstacle sensing, a resultant velocity away from obstacles in the path of the cleaning apparatus.