Patents by Inventor Antonius Johannes Matheus de Graauw
Antonius Johannes Matheus de Graauw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106105Abstract: In accordance with a first aspect of the present disclosure, an antenna unit is provided, comprising: an integrated circuit package containing an integrated circuit die and an antenna structure coupled to the integrated circuit die; a dielectric layer separated from the integrated circuit package, wherein the dielectric layer is placed at a predefined distance above an upper surface of the integrated circuit package. In accordance with a second aspect of the present disclosure, a corresponding method of producing an antenna unit is conceived.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Inventors: Waqas Hassan Syed, Ralph Matthijs van Schelven, Giorgio Carluccio, Pieter Lok, Antonius Johannes Matheus de Graauw, Konstantinos Doris, Daniele Cavallo, Andrea Neto
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Patent number: 11810875Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.Type: GrantFiled: April 9, 2021Date of Patent: November 7, 2023Assignee: NXP B.V.Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
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Patent number: 11777204Abstract: A package includes an integrated circuit, IC, die having circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher. The die is coupled to an interconnect layer extending out from a footprint of the die. The launcher is formed in a launcher-substrate, separate from the die. The launcher is coupled to the die to pass the signalling therebetween by a connection in the interconnect layer. The launcher includes a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity including a ground plane arranged opposed to and spaced from the first plane. The waveguide-cavity is further defined by at least one side wall extending from the ground plane towards the first plane. The die and launcher are at least partially surrounded by mould material of the package.Type: GrantFiled: November 2, 2021Date of Patent: October 3, 2023Assignee: NXP B.V.Inventors: Giorgio Carluccio, Michael B. Vincent, Maristella Spella, Antonius Johannes Matheus de Graauw, Harshitha Thippur Shivamurthy
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Patent number: 11631625Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: GrantFiled: August 17, 2022Date of Patent: April 18, 2023Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20220392821Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: ApplicationFiled: August 17, 2022Publication date: December 8, 2022Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20220328432Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.Type: ApplicationFiled: April 9, 2021Publication date: October 13, 2022Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
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Patent number: 11456227Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: GrantFiled: December 17, 2019Date of Patent: September 27, 2022Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Patent number: 11415626Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.Type: GrantFiled: December 11, 2020Date of Patent: August 16, 2022Assignee: NXP B.V.Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
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Publication number: 20220231408Abstract: A package comprising, an integrated circuit, IC, die comprising circuitry configured to generate signalling for transmission to a waveguide and/or receive signalling from a waveguide via a launcher, the die coupled to an interconnect layer extending out from a footprint of the die; and the launcher is formed in a launcher-substrate, separate from the die, the launcher coupled to the die to pass said signalling therebetween by a connection in said interconnect layer, wherein said launcher comprises a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity comprising a ground plane arranged opposed to and spaced from the first plane, the waveguide-cavity further defined by at least one side wall extending from the ground plane towards the first plane; and wherein said die and said launcher are at least partially surrounded by mould material of said package.Type: ApplicationFiled: November 2, 2021Publication date: July 21, 2022Inventors: Giorgio Carluccio, Michael B. Vincent, Maristella Spella, Antonius Johannes Matheus de Graauw, Harshitha Thippur Shivamurthy
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Patent number: 11380634Abstract: Aspects are directed to a waveguide structure that can couple to an integrated circuit package. The IC package includes a plurality of pillars to provide a path for carrying millimeter-wave signals, each of the pillars having a first end portion to connect to the IC package and a second end portion to connect to a waveguide antenna. Also, as may be optionally included, waveguide shields provide electro-magnetic isolation for the pillars and a micro-strip connector to provide connection between the second end portions (of the pillars) and to the waveguide antenna. Further included in the apparatus are a plurality of bond wires to connect the IC package and a lead frame, and to carry signals form circuitry of the IC package to the printed circuit board on which the package is mounted for transmission of radar signals via the waveguide antenna.Type: GrantFiled: May 17, 2019Date of Patent: July 5, 2022Assignee: NXP B.V.Inventors: Antonius Johannes Matheus de Graauw, Antonius Hendrikus Jozef Kamphuis, Sander Jacobus Geluk
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Patent number: 11276654Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.Type: GrantFiled: December 17, 2019Date of Patent: March 15, 2022Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20220018929Abstract: A radar system includes a hybrid-power amplifier and a power control unit coupled to the hybrid-power amplifier. The power control unit is configured to control the amplification of a chirp signal output by the radar system based upon an assessment of an interchirp time provided by a chirp profile. The interchirp time is a time difference between a first chirp signal and a second chirp signal that are to be output by the hybrid-power amplifier. When the power control unit determines that the interchirp time is less than an interchirp time threshold, a fast-power loop control configuration is used to control the transmitted output power at hybrid amplifier level. When the power control unit determines that the interchirp time is equal to or greater than the interchirp time threshold, a slow-power loop configuration or a combination of the slow-loop configuration and the fast-loop configuration is used to control the transmitted output power at the hybrid-power amplifier.Type: ApplicationFiled: June 29, 2021Publication date: January 20, 2022Inventors: Gilles Montoriol, Cristian Pavao Moreira, Maarten Lont, Antonius Johannes Matheus de Graauw
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Patent number: 11133578Abstract: A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.Type: GrantFiled: September 6, 2019Date of Patent: September 28, 2021Assignee: NXP B.V.Inventors: Antonius Hendrikus Jozef Kamphuis, Antonius Johannes Matheus de Graauw, Adrianus Buijsman, Michael B. Vincent
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Publication number: 20210239754Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.Type: ApplicationFiled: December 11, 2020Publication date: August 5, 2021Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
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Publication number: 20210183797Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.Type: ApplicationFiled: December 17, 2019Publication date: June 17, 2021Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20210183725Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: ApplicationFiled: December 17, 2019Publication date: June 17, 2021Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20210075081Abstract: A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Applicant: NXP B.V.Inventors: Antonius Hendrikus Jozef Kamphuis, Antonius Johannes Matheus de Graauw, Adrianus Buijsman, Michael B. Vincent
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Publication number: 20200365535Abstract: Aspects are directed to a waveguide structure that can couple to an integrated circuit package. The IC package includes a plurality of pillars to provide a path for carrying millimeter-wave signals, each of the pillars having a first end portion to connect to the IC package and a second end portion to connect to a waveguide antenna. Also, as may be optionally included, waveguide shields provide electro-magnetic isolation for the pillars and a micro-strip connector to provide connection between the second end portions (of the pillars) and to the waveguide antenna. Further included in the apparatus are a plurality of bond wires to connect the IC package and a lead frame, and to carry signals form circuitry of the IC package to the printed circuit board on which the package is mounted for transmission of radar signals via the waveguide antenna.Type: ApplicationFiled: May 17, 2019Publication date: November 19, 2020Inventors: Antonius Johannes Matheus de Graauw, Antonius Hendrikus Jozef Kamphuis, Sander Jacobus Geluk
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Patent number: 10539658Abstract: A method of radar detection and a radar system for a motor vehicle are described. The radar system includes a transmitter for transmitting a radar signal having a time period, a plurality of receivers for receiving the transmitted radar signal reflected by an object, a signal compressor having a plurality inputs coupled to each of the receivers and at least one signal compressor output, the signal compressor being configured to compress the received signals to fewer output signals, each output signal having a number of samples. A signal re-constructor having at least one input coupled to each the signal compressor output and configured to determine a plurality signal strength values from the compressed signals, each signal strength value corresponding to a signal strength for a respective time-of-flight and angle-of-arrival value pair of a received signal. The radar system may detect an object with less memory and a lower power consumption while maintaining angular resolution.Type: GrantFiled: February 21, 2017Date of Patent: January 21, 2020Assignee: NXP B.V.Inventors: Zoran Zivkovic, Antonius Johannes Matheus De Graauw
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Publication number: 20170248686Abstract: A method of radar detection and a radar system for a motor vehicle are described. The radar system includes a transmitter for transmitting a radar signal having a time period, a plurality of receivers for receiving the transmitted radar signal reflected by an object, a signal compressor having a plurality inputs coupled to each of the receivers and at least one signal compressor output, the signal compressor being configured to compress the received signals to fewer output signals, each output signal having a number of samples. A signal re-constructor having at least one input coupled to each the signal compressor output and configured to determine a plurality signal strength values from the compressed signals, each signal strength value corresponding to a signal strength for a respective time-of-flight and angle-of-arrival value pair of a received signal. The radar system may detect an object with less memory and a lower power consumption while maintaining angular resolution.Type: ApplicationFiled: February 21, 2017Publication date: August 31, 2017Inventors: Zoran ZIVKOVIC, Antonius Johannes Matheus DE GRAAUW