Abstract: An article, for example a semiconductor wafer, is temporarily secured to a support without using a cement so that a treatment such as polishing may be carried out. The support has at least one recess and the article is positioned on the recess. The support with the article are then placed in a space in which sub-atmospheric pressure is produced so that gas escapes from the recess. When the sub-atmospheric pressure in the space is removed, the article closes the recess so that sub-atmospheric pressure is maintained there resulting in temporary adhesion of the article to the support.