Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

Abstract: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.

Abstract: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.

Abstract: A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.

Abstract: A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.

Abstract: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.

Abstract: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.

Abstract: An improved capacitor with an anode with an anode wire and an oxide layer on the surface of the anode. A cathode layer is exterior to the oxide layer. A carbon conductive layer is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt % resin and 25-95 wt % conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer.

Abstract: An improved capacitor with an anode with an anode wire and an oxide layer on the surface of the anode. A cathode layer is exterior to the oxide layer. A carbon conductive layer is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt % resin and 25-95 wt % conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer.

Abstract: A resistive composition that has a positive temperature coefficient with an increased resistance change over temperature. The composition, based on total composition includes 5-30 wt. % of polymer resin and 10-50 wt. % conductive particles and 30-60 wt. % organic solvent. The polymer resin and conductive particles are dispersed in the organic solvent. The conductive particles are selected from the group consisting of milled carbon fibers, milled vapor grown carbon fibers, milled carbon nanotubes and mixtures thereof. The resistive composition can be used to make an applied film for a mirror heater.

Abstract: A resistive composition for screen printing onto a substrate to form a cured film. The resistive composition, based on total composition, has a) 5-30 wt. % of polymer resin, b) 10-30 wt. % conductive particles selected from the group consisting of carbon black, graphite and mixtures thereof and c) 0.1-10 wt. % zirconia particles, wherein all of (a), (b), and (c) are dispersed in a 60-80 wt. % organic solvent. A cured resistive film composition is also disclosed.