Patents by Inventor Antony Ravi Philip

Antony Ravi Philip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer edge inspection illumination system
    Patent number: 9062859
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: June 23, 2015
    Assignee: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • Method of monitoring fabrication processing including edge bead removal processing
    Patent number: 8492178
    Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: July 23, 2013
    Assignee: Rudolph Technologies, Inc.
    Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip
  • Wafer edge inspection
    Patent number: 8426223
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: April 23, 2013
    Assignee: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • WAFER EDGE INSPECTION
    Publication number: 20110263049
    Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
    Type: Application
    Filed: September 8, 2009
    Publication date: October 27, 2011
    Applicant: Rudolph Technologies, Inc.
    Inventors: Christopher Voges, Ajay Pai, Antony Ravi Philip, Tuan D. Le
  • WAFER FABRICATION MONITORING SYSTEMS AND METHODS, INCLUDING EDGE BEAD REMOVAL PROCESSING
    Publication number: 20110054659
    Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.
    Type: Application
    Filed: February 25, 2008
    Publication date: March 3, 2011
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventors: Alan Carlson, Ajay Pai, Tuan D. Le, Antony Ravi Philip