Abstract: A method for manufacturing printed circuit boards has a double etch process to form interconnection wiring. A metal layer is formed on the substrate. An etch resist layer is applied to the metal layer. The layer is selectively removed to allow for selective etching of the metal layer. A second etch resist layer is applied to the metal layer not previously etched. The side walls of the metal layer are also protected by the resist. The second etch resist layer is then selectively removed to allow for a second etching of the metal layer. After the second etching, the interconnection wiring remains in the desired pattern. The second etch resist layer, which may be tin, can be left on the wiring to improve component soldering.

Abstract: A method and coating material for applying electrically conductive printed patterns to insulating substrates is provided. The coating material includes a non-metallic, grainy carrier substance having metal of the oxidation degree 0 applied thereto. An energy radiation source, particularly of a deflectable laser beam, is used to secure anchoring of the carrier substance to the substrate in the region of the desired printed pattern. As a consequence of a three-dimensional arrangement of the metal, a three-dimensional nuclei distribution is produced that leads to a reliable and fast metallization of the printed pattern on the basis of chemical metal deposition. The method of the invention is especially suited for laser pattern transfer for the manufacture of printed circuit boards.

Abstract: An apparatus for non-contacting modification of the surface of an article such as for labeling a glass article, characterized by a laser beam, a sweep device for deflecting the laser beam as a swept beam in a given path, a deflection device separate from the sweep device for deflecting the swept beam in a desired path for forming a label on the surface of the article. Due to the separation of the deflection device and sweep device, the sweep device can be constructed as small as possible with a low moment of inertia for the movable parts to enable obtaining significantly higher sweep frequencies. As a result, a high sweep frequency, preferably in amounts of at least 500 Hz, can be obtained and a sharp edge erosion without macroscopic splintering is guaranteed during the labeling of a glass article with the apparatus.

Abstract: The deflection of a light beam in two mutually perpendicular directions ensues by rotating two spindles which are hinged to a single deflection mirror and whose axes reside perpendicular to one another. The first spindle is hinged to the deflection mirror via a fork joint such that the trunnion axis of said fork joint and the axis of the first spindle are perpendicular to one another. The second spindle is hinged to the deflection mirror via a turning arm and a dog secured to the backside of the deflection mirror. So that the two spindles can be turned independently of one another, the dog is guided in the turning arm so as to be freely pivotable around the axis of the first spindle. The dog is preferably guided in a slot of the turning arm. Apparatus equipped with only a single deflection mirror for the deflection of a light beam in two mutually perpendicular directions are usefully employed in laser labeling.

Abstract: A method and apparatus for simultaneously labeling or inscribing two parts by using a laser beam, characterized by a beam from a laser being subdivided into two sub-beams which are guided to a deflection optic system with different angles of incidence so that the deflected sub-beams when focused on a work surface are laterally displaced to enable inscribing or labeling two parts.

Abstract: A method and apparatus for adjusting the reference system of a pre-programmable laser device relative to the position of an inscription field of a part to be processed such as a silicon wafer characterized by a laser beam from a laser operating in a continuous wave mode being programmed to travel in various search motions with each motion traversing and passing over an edge of the part. The light which is unblocked by the part is received by a photoelectric element to trigger a position signal for each time the light passes across the edge of the wafer. The precise position of the wafer or part relative to the reference system is calculated from the position signals with the assistance of a computer and subsequently the coordinates of the reference system are corrected to match the precise position of the part.