Patents by Inventor Antti JORTIKKA

Antti JORTIKKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10262921
    Abstract: A semiconductor module includes a baseplate, a cover element attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface of the baseplate is provided with laser machined grooves suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules as disclosed.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: April 16, 2019
    Assignee: LAPPEENRANNAN TEKNILLINEN YLIOPISTO
    Inventors: Mika Lohtander, Leevi Paajanen, Tapani Siivo, Antti Jortikka, Hannu Ylisiurua, Emma Paasonen, Jyrki Montonen
  • Publication number: 20180012822
    Abstract: A semiconductor module includes a baseplate, a cover element attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface of the baseplate is provided with laser machined grooves suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules as disclosed.
    Type: Application
    Filed: December 30, 2015
    Publication date: January 11, 2018
    Applicant: Lappeenrannan Teknillinen Yliopisto
    Inventors: Mika LOHTANDER, Leevi PAAJANEN, Tapani SIIVO, Antti JORTIKKA, Hannu YLISIURUA, Emma PAASONEN, Jyrki MONTONEN