Patents by Inventor Antti Keränen
Antti Keränen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11166364Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: March 30, 2020Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Publication number: 20210243898Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.Type: ApplicationFiled: March 29, 2021Publication date: August 5, 2021Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20210157047Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.Type: ApplicationFiled: January 20, 2021Publication date: May 27, 2021Inventors: Antti Keränen, Mikko Heikkinen
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Patent number: 10986735Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.Type: GrantFiled: October 24, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986734Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: September 25, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986733Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: November 15, 2017Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10928583Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.Type: GrantFiled: May 11, 2020Date of Patent: February 23, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen
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Publication number: 20200396841Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10813222Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: GrantFiled: January 21, 2020Date of Patent: October 20, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20200284974Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.Type: ApplicationFiled: May 11, 2020Publication date: September 10, 2020Inventors: Antti KERÄNEN, Mikko HEIKKINEN
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Publication number: 20200229295Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: ApplicationFiled: January 11, 2019Publication date: July 16, 2020Inventors: Antti KERÄNEN, Tomi SIMULA, Mikko HEIKKINEN, Jarmo SÄÄSKI, Pasi RAAPPANA, Minna PIRKONEN
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Publication number: 20200229296Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: ApplicationFiled: March 30, 2020Publication date: July 16, 2020Inventors: Antti KERÄNEN, Tomi SIMULA, Mikko HEIKKINEN, Jarmo SÄÄSKI, Pasi RAAPPANA, Minna PIRKONEN
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Patent number: 10670800Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.Type: GrantFiled: October 10, 2018Date of Patent: June 2, 2020Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen
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Patent number: 10667401Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.Type: GrantFiled: July 25, 2018Date of Patent: May 26, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Antti Keränen, Jarmo Sääski, Ronald H. Haag
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Publication number: 20200154573Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: January 21, 2020Publication date: May 14, 2020Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10645796Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: January 11, 2019Date of Patent: May 5, 2020Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Patent number: 10575407Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.Type: GrantFiled: June 26, 2018Date of Patent: February 25, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10485094Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.Type: GrantFiled: August 27, 2018Date of Patent: November 19, 2019Assignee: TACTOTEK OYInventors: Anne Isohätälä, Hasse Sinivaara, Heikki Tuovinen, Ville Wallenius, Vinski Bräysy, Tomi Simula, Mikko Heikkinen, Minna Pirkonen, Tuukka Junkkari, Jarmo Sääski, Janne Asikkala, Antti Keränen
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Patent number: 10401547Abstract: Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the maskinType: GrantFiled: October 10, 2018Date of Patent: September 3, 2019Assignee: TACTOTEK OYInventor: Antti Keränen
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Patent number: 10288800Abstract: An integrated multilayer structure including a substrate film having a first side and an opposing second side; electronics including at least one light source, provided upon the first side and a number of electrical conductors, at least electrically coupled to the at least one light source which is configured to emit light in selected one or more frequencies or wavelengths; an optically transmissive element including thermoplastic optically transmissive material having a first refractive index and produced onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and optical cladding including material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film.Type: GrantFiled: December 8, 2018Date of Patent: May 14, 2019Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen