Abstract: A platelike glass element is provided that includes a first surface, a second surface opposite the first, and a hole that perforates the first surface. The first surface has, at least partially around the hole, has a feature selected from a group consisting of: a height deviation with respect to the first surface that is greater than 0.005 ?m, is greater than 0.05 ?m, less than 0.1 ?m, less than 0.3 ?m, a less than 0.5 ?m, and combinations thereof. The first surface has an average roughness value that is less than 15 nm. The edge between the first surface and the hole that is free of elevations.

Abstract: A platelike glass element is provided that includes a first surface, a second surface opposite the first, and a hole that perforates the first surface. The hole extends in a longitudinal direction and a transverse direction, where the longitudinal direction is transverse to the first surface. The first surface has, at least partially around the hole, an elevation. The elevation has a feature selected from a group consisting of: a height of less than 5 ?m that at least partially around the hole, a height greater than 0.05 ?m, a height greater than 0.5 ?m, a height greater than 1 ?m, a height greater than 10 ?m, a height less than 20 ?m, a height less than 15 ?m, a height less than 12 ?m, and combinations thereof. The first surface has an average roughness value that is greater than 15 nm and less than 100 nm.

Abstract: A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q1) of the contact area from the radiative reflection.

Abstract: A hermetically sealed package includes: at least one cover substrate which is sheet-like and includes a flat outer surface and a circumferential narrow side, the at least one cover substrate being formed as a transparent thin film substrate, the at least one cover substrate having a thickness of less than 200 ?m; a second substrate which is adjoined to the at least one cover substrate and in direct contact with the at least one cover substrate; at least one functional area enclosed by the hermetically sealed package, the at least one functional area being between the at least one cover substrate and the second substrate; and a laser bonding line which joins the at least one cover substrate and the second substrate directly and in a hermetically tight manner.

Abstract: An article is produced by welding a first piece to a second piece by a laser beam. The first piece includes an open cavity and a first sealing surface. The second piece has a second sealing surface. The first piece and second piece are inside chamber with a controllable internal pressure that is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces. The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface. The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed. A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.

Abstract: A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.

Abstract: A substrate stack includes: at least two substrates including a base substrate and a cover substrate; at least one first laser weld line for welding the base substrate and the cover substrate; and at least one second beam spot or at least one second laser weld line at least one of situated next to the at least one first laser weld line or positioned such that a stress reduction in the at least one first laser weld line is achieved by the at least one second beam spot or second laser weld line, thus improving the mechanical stability of the substrate stack.

Abstract: A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Abstract: An article is produced by welding a first piece to a second piece by a laser beam. The first piece, includes an open cavity and a first sealing surface. The second piece, has a second sealing surface, A chamber has controllable internal pressure. The first piece and the second piece are inside the closed chamber. The internal pressure of the chamber is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.