Abstract: A hermetically sealed enclosure is shown, comprising at least a first substrate and a second substrate, a function zone that is circumferentially enclosed in the enclosure, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld line to hermetically weld the substrates of the enclosure with each other and/or to hermetically seal the function zone, and at least one reduction zone for reducing an amount of molecules in the function zone.

Abstract: An enclosure is shown, comprising at least a first substrate having an outer surface and a second substrate having an outer surface, wherein the first substrate and the second substrate are arranged next to each other in such a way, that an inner surface of the first substrate is adjacent to an inner surface of the second substrate, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld zone containing an information pattern in the enclosure, wherein the at least one laser weld zone extends from within the first substrate to within the second substrate and permanently joins the first substrate to the second substrate.

Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Abstract: A platelike glass element is provided that includes a first surface, a second surface opposite the first, and a hole that perforates the first surface. The hole extends in a longitudinal direction and a transverse direction, where the longitudinal direction is transverse to the first surface. The first surface has, at least partially around the hole, an elevation. The elevation has a feature selected from a group consisting of: a height of less than 5 ?m that at least partially around the hole, a height greater than 0.05 ?m, a height greater than 0.5 ?m, a height greater than 1 ?m, a height greater than 10 ?m, a height less than 20 ?m, a height less than 15 ?m, a height less than 12 ?m, and combinations thereof. The first surface has an average roughness value that is greater than 15 nm and less than 100 nm.

Abstract: A platelike glass element is provided that includes a first surface, a second surface opposite the first, and a hole that perforates the first surface. The first surface has, at least partially around the hole, has a feature selected from a group consisting of: a height deviation with respect to the first surface that is greater than 0.005 ?m, is greater than 0.05 ?m, less than 0.1 ?m, less than 0.3 ?m, a less than 0.5 ?m, and combinations thereof. The first surface has an average roughness value that is less than 15 nm. The edge between the first surface and the hole that is free of elevations.

Abstract: A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q1) of the contact area from the radiative reflection.

Abstract: A hermetically sealed package includes: at least one cover substrate which is sheet-like and includes a flat outer surface and a circumferential narrow side, the at least one cover substrate being formed as a transparent thin film substrate, the at least one cover substrate having a thickness of less than 200 ?m; a second substrate which is adjoined to the at least one cover substrate and in direct contact with the at least one cover substrate; at least one functional area enclosed by the hermetically sealed package, the at least one functional area being between the at least one cover substrate and the second substrate; and a laser bonding line which joins the at least one cover substrate and the second substrate directly and in a hermetically tight manner.

Abstract: An article is produced by welding a first piece to a second piece by a laser beam. The first piece includes an open cavity and a first sealing surface. The second piece has a second sealing surface. The first piece and second piece are inside chamber with a controllable internal pressure that is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces. The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface. The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed. A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.

Abstract: A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.

Abstract: A substrate stack includes: at least two substrates including a base substrate and a cover substrate; at least one first laser weld line for welding the base substrate and the cover substrate; and at least one second beam spot or at least one second laser weld line at least one of situated next to the at least one first laser weld line or positioned such that a stress reduction in the at least one first laser weld line is achieved by the at least one second beam spot or second laser weld line, thus improving the mechanical stability of the substrate stack.

Abstract: A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.

Abstract: A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Abstract: An article is produced by welding a first piece to a second piece by a laser beam. The first piece, includes an open cavity and a first sealing surface. The second piece, has a second sealing surface, A chamber has controllable internal pressure. The first piece and the second piece are inside the closed chamber. The internal pressure of the chamber is changed to cause a flow of a gas from the open cavity. The open cavity is closed by moving at least one of the pieces The first sealing surface forms a partially gas tight preliminary joint with the second sealing surface The first piece and the second piece define an interface. The chamber is opened after the preliminary joint has been formed A welded seam is formed by focusing a laser beam to the interface after the chamber is opened. The first sealing surface and the second sealing surface are substantially planar.

Abstract: Two substrate pieces are welded together with a focused laser beam. One of the pieces is transparent in the wave length of the laser beam. The two pieces are pressed together so the tops of the roughness of the joining surfaces become level and both a uniform and pocket like air layer is removed from between the surfaces. The focal point of the laser beam is focused in the common boundary surface of the substrate pieces and the pieces are set to movement in relation to the laser beam so that the focal point advances in the boundary surface according to the shape and length of the weld. The energy of the focal point melts the material of the two pieces at the same time. When the melts mix and harden, a weld is formed that joins the pieces hermetically and goes round the third piece(s) isolating it hermetically.

Abstract: Two substrate pieces are welded together with a focused laser beam. One of the pieces is transparent in the wave length of the laser beam. The two pieces are pressed together so the tops of the roughness of the joining surfaces become level and both a uniform and pocket like air layer is removed from between the surfaces. The focal point of the laser beam is focused in the common boundary surface of the substrate pieces and the pieces are set to movement in relation to the laser beam so that the focal point advances in the boundary surface according to the shape and length of the weld. The energy of the focal point melts the material of the two pieces at the same time. When the melts mix and harden, a weld is formed that joins the pieces hermetically and goes round the third piece(s) isolating it hermetically.

Abstract: A method of welding together pieces that contain substratum includes focusing a laser beam to their common surface between them so the focal point energy melts material in both pieces at the same time. The focused laser beam is set to move in relation of the pieces that do not move in relation to each other with such a velocity that the melted material when getting hard forms a united welded seam. When the surfaces to be joined together are three-dimensional the height position of the laser beam focal point is altered following the measuring results of a light beam that advances in front of the laser beam so that it focuses all the time with a certain accuracy to the common surface.