Patents by Inventor Anubhav RUSTOGI

Anubhav RUSTOGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20240029916
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: October 5, 2023
    Publication date: January 25, 2024
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 11830640
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: November 28, 2023
    Assignee: Alpha Assembly Solutions, Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • COMPOSITION FOR USE IN THE MANUFACTURE OF AN IN-MOULD ELECTRONIC (IME) COMPONENT
    Publication number: 20230374289
    Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.
    Type: Application
    Filed: October 7, 2021
    Publication date: November 23, 2023
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Bawa SINGH, Rahul RAUT, Vasuki Srinivas KAUSHIK, Ranjit PANDHER, Niveditha NAGARAJAN, Sandeesh M KUMAR, Anubhav RUSTOGI
  • GRAPHENE ENHANCED AND ENGINEERED MATERIALS FOR MEMBRANE TOUCH SWITCH AND OTHER FLEXIBLE ELECTRONIC STRUCTURES
    Publication number: 20230287232
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 14, 2023
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Barun DAS, Supriya DEVARAJAN, Siuli SARKAR, Rahul RAUT, Bawa SINGH, Anubhav RUSTOGI, Anna Jane HARRIS, Keith Paul PARSONS, Jeffrey William BRAHAM
  • Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
    Patent number: 11624000
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 11, 2023
    Assignees: Alpha Assembly Solutions Inc., MacDermid Autotype Limited
    Inventors: Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Anubhav Rustogi, Anna Jane Harris, Keith Paul Parsons, Jeffrey William Braham
  • SINTERING COMPOSITION
    Publication number: 20220371089
    Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 24, 2022
    Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20210350949
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: July 22, 2021
    Publication date: November 11, 2021
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 11139089
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 5, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • LOW PRESSURE SINTERING POWDER
    Publication number: 20210249376
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 12, 2021
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • Low pressure sintering powder
    Patent number: 10998284
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 4, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20200294686
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: May 29, 2020
    Publication date: September 17, 2020
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 10672531
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: June 2, 2020
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • GRAPHENE ENHANCED AND ENGINEERED MATERIALS FOR MEMBRANE TOUCH SWITCH AND OTHER FLEXIBLE ELECTRONIC STRUCTURES
    Publication number: 20200087528
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Application
    Filed: May 22, 2018
    Publication date: March 19, 2020
    Inventors: Nirmalya Kumar CHAKI, Chetan Pravinchandra SHAH, Barun DAS, Supriya DEVARAJAN, Siuli SARKAR, Rahul RAUT, Bawa SINGH, Anubhav RUSTOGI, Anna Jane HARRIS, Keith Paul PARSONS, Jeffrey William BRAHAM
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20170200527
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: July 14, 2015
    Publication date: July 13, 2017
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Low Pressure Sintering Powder
    Publication number: 20170033073
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Application
    Filed: April 10, 2015
    Publication date: February 2, 2017
    Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Poulami Sengupta ROY, Siuli SARKAR, Anubhav RUSTOGI