Patents by Inventor Anupam CHOUBEY

Anupam CHOUBEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRE-APPLIED UNDERFILL
    Publication number: 20150371916
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 24, 2015
    Inventors: Robert K. BARR, Edgardo ANZURES, Jeffrey M. CALVERT, Herong LEI, David FLEMING, Avin V. DHOBLE, Anupam CHOUBEY
  • PRE-APPLIED UNDERFILL
    Publication number: 20150064851
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Inventors: Michael K. GALLAGHER, Edgardo ANZURES, David FLEMING, Avin V. DHOBLE, Chi Q. TRUONG, Anupam CHOUBEY, Jeffrey M. CALVERT