Patents by Inventor Anupriya Sriramulu

Anupriya Sriramulu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11599497
    Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 7, 2023
    Assignee: Intel Corporation
    Inventors: Zuoguo Wu, Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka, Timothy Wig, Jeff Morriss
  • Publication number: 20200394151
    Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Zuoguo Wu, Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka, Timothy Wig, Jeff Morriss
  • Patent number: 10789201
    Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Zuoguo Wu, Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka, Timothy Wig, Jeff Morriss
  • Publication number: 20180253398
    Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
    Type: Application
    Filed: June 29, 2017
    Publication date: September 6, 2018
    Inventors: Zuoguo Wu, Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka, Timothy Wig, Jeff Morriss
  • Patent number: 9935063
    Abstract: Integrated circuit (IC) chip “on-die” inductor structures (systems and methods for their manufacture) may improve signaling from a data signal circuit to a surface contact of the chip. Such inductor structures may include a first data signal inductor having (1) a second end electrically coupled to an electrostatic discharge (ESD) circuit and a capacitance value of that circuit, and (2) a first end electrically coupled to a the data signal surface contact and to a capacitance value at that contact; and a second data signal inductor having (1) a second end electrically coupled to the data signal circuit and a capacitance value of that circuit, (2) a first end electrically coupled to the second end of the first data signal inductor, and to the capacitance value of the ESD circuit. Inductor values of the first and second inductors may be selected to cancel out the capacitance values to improve signaling.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 3, 2018
    Assignee: Intel Corporation
    Inventors: Yu Amos Zhang, Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, MD. Mohiuddin Mazumder, Frank O'Mahony, Zuoguo Wu, Kemal Aygun
  • Publication number: 20180005965
    Abstract: Integrated circuit (IC) chip “on-die” inductor structures (systems and methods for their manufacture) may improve signaling from a data signal circuit to a surface contact of the chip. Such inductor structures may include a first data signal inductor having (1) a second end electrically coupled to an electrostatic discharge (ESD) circuit and a capacitance value of that circuit, and (2) a first end electrically coupled to a the data signal surface contact and to a capacitance value at that contact; and a second data signal inductor having (1) a second end electrically coupled to the data signal circuit and a capacitance value of that circuit, (2) a first end electrically coupled to the second end of the first data signal inductor, and to the capacitance value of the ESD circuit. Inductor values of the first and second inductors may be selected to cancel out the capacitance values to improve signaling.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 4, 2018
    Inventors: Yu Amos ZHANG, Jihwan KIM, Ajay BALANKUTTY, Anupriya SRIRAMULU, MD. Mohiuddin MAZUMDER, Frank O'MAHONY, Zuoguo WU, Kemal AYGUN
  • Publication number: 20160182257
    Abstract: An apparatus is described herein. The apparatus comprises a physical layer (PHY), wherein analog circuitry of the physical layer is to determine a data rate. The apparatus also comprises a media access layer (MAC), wherein the media access layer is to receive the data rate from the physical layer.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Applicant: Intel Corporation
    Inventors: Daniel Froelich, Zuoguo Wu, Anupriya Sriramulu