Patents by Inventor Anwar A. Mohammad

Anwar A. Mohammad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced electronic package
    Patent number: 7811862
    Abstract: According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 ?m or less and a thermal conductivity of about 60 W/m·K or greater.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: October 12, 2010
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammad, Soon Ing Chew
  • Thermally Enhanced Electronic Package
    Publication number: 20100148326
    Abstract: According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 ?m or less and a thermal conductivity of about 60 W/m·K or greater.
    Type: Application
    Filed: December 17, 2008
    Publication date: June 17, 2010
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammad, Julius Chew