Abstract: A computing device accesses a machine learning model trained on training data of first bonding operations (e.g., a ball and/or stitch bond). The first bonding operations comprise operations to bond a first set of multiple wires to a first set of surfaces. The machine learning model is trained by supervised learning. The device receives input data indicating process data generated from measurements of second bonding operations. The second bonding operations comprise operations to bond a second set of multiple wires to a second set of surfaces. The device weights the input data according to the machine learning model. The device generates an anomaly predictor indicating a risk for an anomaly occurrence in the second bonding operations based on weighting the input data according to the machine learning model. The device outputs the anomaly predictor to control the second bonding operations.

Abstract: A computing device accesses a machine learning model trained on training data of first bonding operations (e.g., a ball and/or stitch bond). The first bonding operations comprise operations to bond a first set of multiple wires to a first set of surfaces. The machine learning model is trained by supervised learning. The device receives input data indicating process data generated from measurements of second bonding operations. The second bonding operations comprise operations to bond a second set of multiple wires to a second set of surfaces. The device weights the input data according to the machine learning model. The device generates an anomaly predictor indicating a risk for an anomaly occurrence in the second bonding operations based on weighting the input data according to the machine learning model. The device outputs the anomaly predictor to control the second bonding operations.

Abstract: A computing device accesses a machine learning model trained on training data of first bonding operations (e.g., a ball and/or stitch bond). The first bonding operations comprise operations to bond a first set of multiple wires to a first set of surfaces. The machine learning model is trained by supervised learning. The device receives input data indicating process data generated from measurements of second bonding operations. The second bonding operations comprise operations to bond a second set of multiple wires to a second set of surfaces. The device weights the input data according to the machine learning model. The device generates an anomaly predictor indicating a risk for an anomaly occurrence in the second bonding operations based on weighting the input data according to the machine learning model. The device outputs the anomaly predictor to control the second bonding operations.

Abstract: A computing system determines if an event has occurred. A first window is defined that includes a subset of a plurality of observation vectors modeled as an output of an autoregressive causal system. A magnitude adjustment vector is computed from a mean computed for a matrix of magnitude values that includes a column for each window of a plurality of windows. The first window is stored in a next column of the matrix of magnitude values. Each cell of the matrix of magnitude values includes an estimated power spectrum value for a respective window and a respective frequency. A second matrix of magnitude values is updated using the magnitude adjustment vector. Each cell of the second matrix of magnitude values includes an adjusted power spectrum value for the respective window and the respective frequency. A peak is detected from the next column of the second matrix of magnitude values.