Abstract: The present disclosure is directed to a semiconductor panel providing a laminated structure and a plurality of electrically isolated structures distributed throughout the laminated structure to increase an attraction between the laminated structure and an electrostatic chuck. In an aspect, the electrically isolated structures are positioned in spaces in the semiconductor panel without electrically active devices and interconnects. In yet another aspect, the present method provides a semiconductor panel and forming a plurality of electrically isolated structures in selected positions on the semiconductor panel and an electrostatic chuck configured to carry an electrostatic charge for producing an electrostatic force at its top surface, placing the semiconductor panel on the electrostatic chuck, and activating the electrostatic chuck to induce polarization at the top surface to produce an attractive force having a greater magnitude at the positions with the plurality of electrically isolated structures.

Abstract: Plated vias for package substrates and related methods are disclosed. A substrate disclosed herein including a core including an opening having an internal wall and an interconnect extending through the core, the interconnect including an outer surface spaced from the internal wall by at least one gap.

Abstract: Substrate assemblies having adhesion promotor layers and related methods are disclosed. An example apparatus includes a substrate, a dielectric layer, a first copper layer between the substrate and the dielectric layer, and a film between the dielectric layer and the first copper layer. The film including silicon and nitrogen and being substantially free of hydrogen. A via in the dielectric layer is to provide access to the first copper layer. A portion of the first copper layer uncovered in the via, a wall of the via and the portion of the first copper layer to be substantially free of fluorine. A seed copper layer positioned on the dielectric layer. The via wall and the portion of the first copper layer. The seed copper layer and the first copper layer define an undercut at an interface between the seed copper layer and the first copper layer.

Abstract: A method and system for calculating main-loop parameters of an SLCC, and a readable medium.

Abstract: According to the various aspects, a hybrid panel assembly includes a glass panel, a frame configured to surround the glass panel, and a layer manufactured binder disposed between and bonds the glass panel and the frame. In an aspect, the layer manufactured binder is made of a cured resin that is formed layer-by-layer and the frame is made of a copper clad laminate.

Abstract: The present disclosure relates to an acceleration unit, an acceleration assembly, an acceleration device, and an electronic device. The application unit is included in a combined processing device. The combined processing apparatus further includes an interconnection interface and other processing device. The application unit interacts with other processing device to jointly complete a computing operation specified by a user. The combined processing device further includes a storage device. The storage device is connected to the acceleration unit and other processing devices, respectively. The storage device is used for data services of the acceleration unit and other processing devices. With the help of the content of the present disclosure, high-speed processing of massive data may be realized.

Abstract: A microelectronic assembly includes a component embedded into a substrate. The component may include one or more passive components, e.g., for power delivery to one or more components attached to the substrate. The component is embedded into a blind cavity, which extends part-way through the substrate. A metal pad may be included under the component, defining the bottom of the cavity. Alternatively, a polymer material may be included under the component, along the bottom of the cavity. The polymer may provide an even surface for mounting the component and ensure that the component is at the correct height in the substrate.

Abstract: The present invention relates to the field of medicines, particularly to synthetic polyamide compounds represented by formulas IA, IB, and IC, or pharmaceutically acceptable salts and stereoisomers thereof, a composition containing same, a method for preparing same, and use thereof in the field of medicines.

Abstract: Embodiments disclosed herein include bridge structures for package substrates. In an embodiment, a package substrate comprises a substrate that is a dielectric material. In an embodiment, a cavity is formed into the substrate. A first pad is on a bottom surface of the cavity, and a die is at least partially in the cavity. In an embodiment, a via passes through at least a portion of a thickness of the die, and a second pad is on the die. In an embodiment, the second pad directly contacts the first pad, and the first pad is the only electrically conductive structure between the via and the second pad.

Abstract: Disclosed in the present invention are a steroid compound, and a preparation method therefor and the use thereof. The structure of the steroid compound is as shown in formula I, and the definition of each substituent in the formula are as described in the description and claims. The steroid compound of the present invention is a steroid compound having the dual functions of excellent AR antagonistic activity and AR degradative activity, has the characteristics of good druggability and safety, and can be used for treating diseases related to an AR signaling pathway.

Abstract: The invention provides an undetermined terminal-based accelerated joint quantum remote state preparation method, including: determining chain channels between at least two sending terminals and a receiving terminal edge node, and determining GHZ channels between the receiving terminal edge node and a plurality of candidate receiving terminals; jointly preparing, by the at least two sending terminals together, to-be-transferred information for the receiving terminal edge node; and sending, by the receiving terminal edge node, the to-be-transferred information to the plurality of candidate receiving terminals, after a target receiving terminal is determined, performing, by the other candidate receiving terminals, a measurement operation, and performing, by the target receiving terminal, corresponding unitary transformation to recover the to-be-transferred information.

Abstract: Disclosed is a calculation method for a mobile fluid saturation after reservoir fracturing based on netting analysis, including: performing a fracturing experiment and micro-computed tomography (CT) experiment designs before and after fracturing; dividing a pore development area and a dense area; comparing micro-CT scanning experimental images of the same reservoir core sample before and after fracturing, and dividing a fracture network formed after fracturing; analyzing the propagation of fracturing fractures by netting analysis; determining a porosity of fracturing reconstruction; further determining a mobile fluid saturation after fracturing; and combining with a logging curve to realize the continuous calculation of mobile fluid saturation after fracturing.

Abstract: A polybenzoxazine aerogel film and a preparation method thereof are provided in the present disclosure, belonging to the field of preparation of aerogel film composite material. The preparation method of the polybenzoxazine aerogel film includes the following steps: dissolving benzoxazine monomer in a solvent and catalyzing to obtain a polybenzoxazine solution; coating the polybenzoxazine solution as a wet gel film; and aging and drying the wet gel film to obtain the polybenzoxazine aerogel film.

Abstract: Disclosed is a calculation method for a mobile fluid saturation after reservoir fracturing based on netting analysis, including: performing a fracturing experiment and micro-computed tomography (CT) experiment designs before and after fracturing; dividing a pore development area and a dense area; comparing micro-CT scanning experimental images of the same reservoir core sample before and after fracturing, and dividing a fracture network formed after fracturing; analyzing the propagation of fracturing fractures by netting analysis; determining a porosity of fracturing reconstruction; further determining a mobile fluid saturation after fracturing; and combining with a logging curve to realize the continuous calculation of mobile fluid saturation after fracturing.

Abstract: The present application discloses a high-toughness ultrahigh-strength steel and a manufacturing method thereof, and belongs to the technical field of metal materials. The present application is intended to solve the problem that the existing low-alloy ultrahigh-strength steel has poor toughness and poor hardenability. The high-toughness ultrahigh-strength steel includes the following elements in mass percentages: C: 0.27% to 0.35%; Si: 1.10% to 1.70%; Mn: 0.70% to 1.10%; Cr: 1.00% to 1.40%; Ni: 0.10% to 0.50%; Mo: 0.05% to 0.50%; W: 0.05% to 0.10%; Nb: 0.01% to 0.04%; and iron and unavoidable impurities: the balance. The high-toughness ultrahigh-strength steel of the present application has excellent strength, toughness and hardenability.

Abstract: An irregularly-shaped display panel and a display device are disclosed. The irregularly-shaped display panel includes an encapsulation area arranged around an opening and an irregularly-shaped display area arranged around the encapsulation area. A plurality of undercut structures in the encapsulation area are spaced apart from each other. The undercut structures include at least one first undercut structure and at least one second undercut structure. The first undercut structure includes a continuous first undercut groove, and the second undercut structure includes a plurality of second undercut grooves separated from each other and a partition part located between the second undercut grooves.

Abstract: This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etching a residual material associated with smearing; an electrostatic stage configured to generate an electrostatic force associated with peeling the dielectric protective film from the semiconductor; and a stage on which the semiconductor is positioned while the electrostatic stage peels the dielectric protective film from the semiconductor, wherein the plasma is further associated with roughening a surface of the semiconductor after peeling the dielectric protective film from the semiconductor.

Abstract: The invention provides an undetermined terminal-based accelerated joint quantum remote state preparation method, including: determining chain channels between at least two sending terminals and a receiving terminal edge node, and determining GHZ channels between the receiving terminal edge node and a plurality of candidate receiving terminals; jointly preparing, by the at least two sending terminals together, to-be-transferred information for the receiving terminal edge node; and sending, by the receiving terminal edge node, the to-be-transferred information to the plurality of candidate receiving terminals, after a target receiving terminal is determined, performing, by the other candidate receiving terminals, a measurement operation, and performing, by the target receiving terminal, corresponding unitary transformation to recover the to-be-transferred information.

Abstract: The present disclosure is directed to a semiconductor panel providing a laminated structure and a plurality of electrically isolated structures distributed throughout the laminated structure to increase an attraction between the laminated structure and an electrostatic chuck. In an aspect, the electrically isolated structures are positioned in spaces in the semiconductor panel without electrically active devices and interconnects. In yet another aspect, the present method provides a semiconductor panel and forming a plurality of electrically isolated structures in selected positions on the semiconductor panel and an electrostatic chuck configured to carry an electrostatic charge for producing an electrostatic force at its top surface, placing the semiconductor panel on the electrostatic chuck, and activating the electrostatic chuck to induce polarization at the top surface to produce an attractive force having a greater magnitude at the positions with the plurality of electrically isolated structures.

Abstract: The present invention relates to a molecular marker, a specific primer pair, and an identification method of the high-quality Ganoderma lucidum strain HMGIM-M624. The high-quality Ganoderma lucidum strain HMGIM-M624 was preserved in Guangdong Microbial Culture Collection Center (address: 5th Floor, No. 59 Building of No. 100 Yard, Mid. Xianlie Road, Guangzhou City) with the preservation number of GDMCC No: 60889 on Nov. 7, 2019. The molecular marker is an InDel molecular marker. The high-quality Ganoderma lucidum strain HMGIM-M624 has a base deletion of CATGCTGTA at the 246451th-246460th site of the chromosome sca34. The present invention provides reagents for detecting the molecular marker of the high-quality Ganoderma lucidum strain HMGIM-M624. The reagents can distinguish the high-quality Ganoderma lucidum strain HMGIM-M624 from the other 11 G. lucidum strains for commercial cultivation, thus specifically identifying the high-quality Ganoderma lucidum strain HMGIM-M624.