Patents by Inventor Aoi HASEGAWA

Aoi HASEGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210284783
    Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 16, 2021
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Chika YAMASHITA, Yoshitaka ISHIBASHI, Tomonori TAJIMA, Hiromi OTAKE
  • Publication number: 20200031973
    Abstract: A curable resin composition, which has excellent flowability and reactivity at the time of molding, with which a highly reliable cured product which has excellent heat resistance can be obtained by curing is provided. A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1): where R1 and R2 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, or a hydroxy group, Q represents a C5-10 cycloalkylene group or a divalent organic group containing an alicyclic fused ring, and Y is an alkenyl group.
    Type: Application
    Filed: April 4, 2018
    Publication date: January 30, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Masatoshi MORI
  • Publication number: 20200031966
    Abstract: A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a): where R1 to R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxy group, Y1 is an alkenyl group.
    Type: Application
    Filed: April 4, 2018
    Publication date: January 30, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI
  • Publication number: 20190225566
    Abstract: Provided is a method with which it is possible to produce a polyalkenylphenol compound having a narrow molecular weight distribution and low viscosity at high purity and high yield. A poly 2-alkenyl aromatic ether compound having two or more phenol skeletons is subjected to Claisen rearrangement in the presence of a phenol or naphthol compound.
    Type: Application
    Filed: August 9, 2017
    Publication date: July 25, 2019
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI