Patents by Inventor Aoya Kengo, III

Aoya Kengo, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER PROCESSING
    Publication number: 20140339673
    Abstract: A method of separating dies of a singulated wafer is disclosed. The method may include supporting the singulated wafer on a supporting portion of a sheet of dicing tape that has a first ring attached to a first annular portion of the sheet that encompasses the supporting portion. The method may further include radially expanding the supporting portion by relative axial displacement of the supporting portion with respect to the first ring. The method may also include further expanding the supporting portion by radially outward displacement of a support surface that supports at least an annular portion of the sheet. The method may also include attaching a second ring to a second annular portion of the sheet.
    Type: Application
    Filed: May 14, 2013
    Publication date: November 20, 2014
    Applicant: Texas Instruments Incorporated
    Inventors: Iriguchi Shoichi, Aoya Kengo, III, Yano Genki, Hayata Kazunori