Patents by Inventor Aparna Bhave

Aparna Bhave has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220133347
    Abstract: An atherectomy system includes an atherectomy burr having one or more blood flow enhancement features that permit an increased level of blood flow past the burr relative to a blood flow that would result absent the one or more flow enhancement features. A drive mechanism is adapted to rotatably actuate the atherectomy burr.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: David C. AUTH, Aparna BHAVE, Gary Thomas OHRT, Travis J. SCHAUER, Neha SHARMA, Evan BENNETT, Andrew Bicek
  • Patent number: 9877853
    Abstract: A bioabsorbable stent comprises a plurality of struts interconnected by a plurality of curved intersections. Each of the plurality of curved intersections defines a crescent shaped opening therethrough. The stent has a manufactured state, a crimped state and an expanded state. The crescent shaped openings each have a width and a length such that in the crimped state the width of the crescent shaped opening is less than the width of the crescent shaped opening in the manufactured state or the expanded state.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 30, 2018
    Assignee: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Aparna Bhave, Dennis A. Boismier, Paul F. Chouinard, Shelley Thurk
  • Publication number: 20160287417
    Abstract: A bioabsorbable stent comprises a plurality of struts interconnected by a plurality of curved intersections. Each of the plurality of curved intersections defines a crescent shaped opening therethrough. The stent has a manufactured state, a crimped state and an expanded state. The crescent shaped openings each have a width and a length such that in the crimped state the width of the crescent shaped opening is less than the width of the crescent shaped opening in the manufactured state or the expanded state.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 6, 2016
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: APARNA BHAVE, DENNIS A. BOISMIER, PAUL F. CHOUINARD, SHELLEY THURK
  • Publication number: 20100145437
    Abstract: The invention is directed to mechanisms and methods that reduce the delamination of a therapeutic agent from a stent. The mechanisms include holes (channels, wells, and other hole configurations), protrusions, sintered metal cores, clamps/staples, pins, and stainless steel shields.
    Type: Application
    Filed: February 17, 2010
    Publication date: June 10, 2010
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Timothy S. Girton, Jeffrey S. Lindquist, David M. Knapp, Matt Heidner, Daniel Gregorich, Umang Anand, Peter Edelman, Matthew J. Miller, Raed Rizq, Jan Weber, Tracee Eidenschink, John J. Chen, Jaykeep Y. Kokate, Aparna Bhave, Kent D. Harrison, Graig L. Kveen, Benjamin Arcand, Michael Kuchling
  • Publication number: 20090076591
    Abstract: The invention is directed to mechanisms and methods that reduce the delamination of a therapeutic agent from a stent. The mechanisms include holes (channels, wells, and other hole configurations), protrusions, sintered metal cores, clamps/staples, pins, and stainless steel shields.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 19, 2009
    Applicant: BOSTON SCIENTIFIC SCIMED, INC.
    Inventors: Timothy S. Girton, Jeffrey S. Lindquist, David M. Knapp, Matt Heidner, Daniel Gregorich, Umang Anand, Peter Edelman, Matthew J. Miller, Raed Rizq, Jan Weber, Tracee Eidenschink, John J. Chen, Jaykeep Y. Kokate, Aparna Bhave, Kent D. Harrison, Graig L. Kveen, Benjamin Arcand, Michael Kuehling
  • Publication number: 20070111145
    Abstract: Thermally developable materials that comprise a support have a conductive backside layer that has increased conductive efficiency. Conductivity is provided by non-acicular metal antimonate particles that are present in an amount greater than 55 and up to 85 dry weight % at a coverage of from about 0.06 to about 0.5 g/m2, and the ratio of total binder polymers in the backside conductive layer to the non-acicular metal antimonate particles is less than 0.75:1 (dry weights). The level of conductive particles is reduced from previous uses without an unacceptable loss in conductivity. In addition, the dry thickness of the conductive layer is considerably reduced.
    Type: Application
    Filed: December 20, 2006
    Publication date: May 17, 2007
    Inventors: Thomas Ludemann, Gary LaBelle, Roland Koestner, John Hefley, Aparna Bhave, Thomas Geisler, Darlene Philip
  • Publication number: 20060194158
    Abstract: The use of metal antimonates at high metal antimonate to binder ratios in buried backside conductive layers of thermographic and photothermographic materials allows the use of thin backside overcoat layers. The combination provides antistatic constructions having excellent antistatic properties that show less change in resistivity with changes in humidity. The thin backside overcoat layer serves to protect the buried antistatic layer.
    Type: Application
    Filed: May 9, 2006
    Publication date: August 31, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Darlene Philip, Roland Koestner, Aparna Bhave
  • Publication number: 20060177781
    Abstract: Buried backside conductive layers with increased conductive efficiency can be provided for thermally developable materials using a specific organic solvent mixture to coat a protective overcoat directly disposed over the conductive layer. This organic solvent mixture comprises an alcohol in which one or more film-forming polymers used in the formulation are soluble at room temperature. The alcohol is used in an amount of more than 10 and up to 90 weight % of the organic solvent mixture.
    Type: Application
    Filed: February 8, 2005
    Publication date: August 10, 2006
    Inventors: Thomas Ludemann, Aparna Bhave, Gary LaBelle, Darlene Philip, Samuel Chen
  • Publication number: 20060046215
    Abstract: The use of metal antimonates at high metal antimonate to binder ratios in buried backside conductive layers of thermographic and photothermographic materials allows the use of thin backside overcoat layers. The combination provides antistatic constructions having excellent antistatic properties that show less change in resistivity with changes in humidity. The thin backside overcoat layer serves to protect the buried antistatic layer.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Darlene Philip, Roland Koestner, Aparna Bhave
  • Publication number: 20060046932
    Abstract: Thermally developable materials that comprise a support have a conductive backside layer that has increased conductive efficiency. Conductivity is provided by non-acicular metal antimonate particles that are present in an amount greater than 55 and up to 85 dry weight % at a coverage of from about 0.06 to about 0.5 g/m2, and the ratio of total binder polymers in the backside conductive layer to the non-acicular metal antimonate particles is less than 0.75:1 (dry weights). The level of conductive particles is reduced from previous uses without an unacceptable loss in conductivity. In addition, the dry thickness of the conductive layer is considerably reduced.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Thomas Ludemann, Gary LaBelle, Roland Koestner, John Hefley, Aparna Bhave, Thomas Geisler, Darlene Philip