Patents by Inventor Aparna Chakrapani Sheila-Vadde

Aparna Chakrapani Sheila-Vadde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7948233
    Abstract: Omnidirectional eddy current array probes for detecting flaws in a conductive test object generally includes semi-circular wave shaped continuous drive lines in two rows disposed in two layers that are multiplexed for omnidirectional inspection without blind spots. The semicircular wave shaped continuous drive lines are superimposed to form pseudo-circular drive lines, wherein each row of drive lines is offset laterally by a distance preferably equal to a quarter wavelength of the wave pattern. For only parallel and perpendicular flaws, the drive multiplexing is not needed and each row will have only one set of drive lines. In alternate embodiments, there can be square-shaped, oval shaped, rectangular-shaped or other shaped wave patterns as well. Also disclosed are methods for sensing surface flaws and compensating their response.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: May 24, 2011
    Assignee: General Electric Company
    Inventors: Aparna Chakrapani Sheila-Vadde, Ui Won Suh, Changting Wang
  • Publication number: 20110068784
    Abstract: A multi-frequency eddy current (MFEC) inspection system is provided for inspection of case hardening depth on a part. The MFEC inspection system comprises a generator configured to generate one or more multi-frequency excitation signals and an eddy current probe configured to be disposed at one side of the part. The eddy current probe comprises one or more drivers and one or more pickup sensors. The one or more drivers are configured to receive the one or more multi-frequency excitation signals to induce eddy currents in the part. The one or more pickup sensors are configured to detect the induced eddy currents within a local area of the part to generate one or more multi-frequency response signals. The MFEC system further comprises a processor configured to receive the one or more multi-frequency response signals for processing to determine a case hardening depth of the local area of the part. A pulse eddy current inspection system and an eddy current inspection method are also presented.
    Type: Application
    Filed: September 21, 2009
    Publication date: March 24, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Haiyan Sun, Yuri Alexeyevich Plotnikov, Changting Wang, Shridhar Champaknath Nath, Aparna Chakrapani Sheila-Vadde
  • Publication number: 20100321012
    Abstract: The invention provides a drive coil and measurement probe comprising the drive coil. The measurement probes can be used, for example, in in-situ, non-destructive testing methods, also provided herein.
    Type: Application
    Filed: August 28, 2010
    Publication date: December 23, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Andrzej Michal May, Waseem Ibrahim Faidi, Changting Wang, Nilesh Tralshawala, Aparna Chakrapani Sheila-Vadde, Mandar Diwakar Godbole, Jamie Thomas Livingston, Steven Haines Olson, Howard Daniel Driver
  • Publication number: 20100134098
    Abstract: The invention provides composite systems, articles comprising the composite system, methods for the in-situ, non-destructive testing of the articles and/or composite systems, as well as array probes useful in the methods. The composite systems comprise a curable resin and at least one plurality of detectable particles.
    Type: Application
    Filed: November 29, 2008
    Publication date: June 3, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Waseem Ibrahim Faidi, Changting Wang, Stephane Renou, Shu Ching Quek, Nilesh Tralshawala, Aparna Chakrapani Sheila-Vadde, Peter J. Fritz
  • Publication number: 20100085045
    Abstract: Omnidirectional eddy current array probes for detecting flaws in a conductive test object generally includes semi-circular wave shaped continuous drive lines in two rows disposed in two layers that are multiplexed for omnidirectional inspection without blind spots. The semicircular wave shaped continuous drive lines are superimposed to form pseudo-circular drive lines, wherein each row of drive lines is offset laterally by a distance preferably equal to a quarter wavelength of the wave pattern. For only parallel and perpendicular flaws, the drive multiplexing is not needed and each row will have only one set of drive lines. In alternate embodiments, there can be square-shaped, oval shaped, rectangular-shaped or other shaped wave patterns as well. Also disclosed are methods for sensing surface flaws and compensating their response.
    Type: Application
    Filed: October 7, 2008
    Publication date: April 8, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Aparna Chakrapani Sheila-Vadde, Ui Won Suh, Changting Wang