Patents by Inventor Aparna Prabhakar
Aparna Prabhakar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240114352Abstract: Steps are presented for deploying a plurality of BS/APs, such as CBSDs (Citizen's Broadband radio Service Devices) in an enterprise network or other such private network at a location such as a warehouse, factory, research center or other building. The deployment is a process by which the BS/APs in the network are set up to be ready for operation within the network. In addition, a communication system is described in which an enterprise operator provides subscription data and commissioning information to an SAS and a Subscriber Database.Type: ApplicationFiled: October 4, 2023Publication date: April 4, 2024Inventors: Sourav Bandyopadhyay, Srinivasan Balasubramanian, Aparna Jaiswal, Mark Jan Dijkstra, Vinay Anneboina, Puneet Prabhakar Shetty, Mohit Goyal
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Patent number: 9335346Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: September 10, 2012Date of Patent: May 10, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Patent number: 9231139Abstract: A substrate has a top side and a bottom side. A solar cell is secured to the top side of the substrate and has an anode and a cathode. A heat transfer element is secured to the bottom side of the substrate. An anode pad is formed on the top side of the substrate and is coupled to the anode of the solar cell; similarly, a cathode pad is formed on the top side of the substrate and is coupled to the cathode of the solar cell. The substrate coefficient of thermal expansion and the solar cell coefficient of thermal expansion match within plus or minus ten parts per million per degree C.Type: GrantFiled: September 30, 2011Date of Patent: January 5, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Yves C. Martin, Jay E. Pogemiller, Aparna Prabhakar, Theodore G. van Kessel, Brent A. Wacaser
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Patent number: 8852408Abstract: An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.Type: GrantFiled: April 29, 2009Date of Patent: October 7, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Mark den Heijer, Aparna Prabhakar, Frances M. Ross, Ranjani Sirdeshmukh
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Patent number: 8679280Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.Type: GrantFiled: May 27, 2010Date of Patent: March 25, 2014Assignee: International Business Machines CorporationInventors: Bing Dang, Matthew Farinelli, John Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang
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Patent number: 8487304Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: April 30, 2010Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Patent number: 8419895Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.Type: GrantFiled: May 27, 2010Date of Patent: April 16, 2013Assignee: International Business Machines CorporationInventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
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Publication number: 20120329295Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: September 10, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Patent number: 8288177Abstract: A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.Type: GrantFiled: August 17, 2010Date of Patent: October 16, 2012Assignee: International Business Machines CorporationInventors: Michael Gaynes, Michael S. Gordon, Nancy C. LaBianca, Kenneth F. Latzko, Aparna Prabhakar
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Publication number: 20120138145Abstract: A substrate has a top side and a bottom side. A solar cell is secured to the top side of the substrate and has an anode and a cathode. A heat transfer element is secured to the bottom side of the substrate. An anode pad is formed on the top side of the substrate and is coupled to the anode of the solar cell; similarly, a cathode pad is formed on the top side of the substrate and is coupled to the cathode of the solar cell. The substrate coefficient of thermal expansion and the solar cell coefficient of thermal expansion match within plus or minus ten parts per million per degree C.Type: ApplicationFiled: September 30, 2011Publication date: June 7, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Yves C. Martin, Jay E. Pogemiller, Aparna Prabhakar, Theodore G. van Kessel, Brent A. Wacaser
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Publication number: 20120045853Abstract: A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.Type: ApplicationFiled: August 17, 2010Publication date: February 23, 2012Applicant: International Business Machines CorporationInventors: Michael Gaynes, Michael S. Gordon, Nancy C. LaBianca, Kenneth F. Latzko, Aparna Prabhakar
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Publication number: 20110290406Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.Type: ApplicationFiled: May 27, 2010Publication date: December 1, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
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Publication number: 20110290413Abstract: A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.Type: ApplicationFiled: May 27, 2010Publication date: December 1, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, Matthew Farinelli, John Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski, Cornelia K. Tsang
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Publication number: 20110290402Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.Type: ApplicationFiled: May 27, 2010Publication date: December 1, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul Andry, Bing Dang, John Knickerbocker, Aparna Prabhakar, Peter Sorce, Robert E. Trzcinski, Cornelia K. Tsang
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Publication number: 20110266539Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20100276277Abstract: An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Inventors: S. Jay Chey, Mark den Heijer, Aparna Prabhakar, Frances M. Ross, Ranjani Sirdeshmukh