Patents by Inventor Aparna R. PRASAD
Aparna R. PRASAD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11762155Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.Type: GrantFiled: August 25, 2021Date of Patent: September 19, 2023Assignee: Cisco Technology, Inc.Inventors: Vipulkumar K. Patel, Matthew J. Traverso, Sandeep Razdan, Aparna R. Prasad
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Patent number: 11756861Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.Type: GrantFiled: May 12, 2022Date of Patent: September 12, 2023Assignee: Cisco Technology, Inc.Inventors: Ashley J. M. Erickson, Matthew J. Traverso, Sandeep Razdan, Joyce J. M. Peternel, Aparna R. Prasad
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Publication number: 20230060862Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.Type: ApplicationFiled: August 25, 2021Publication date: March 2, 2023Inventors: Vipulkumar K. PATEL, Matthew J. TRAVERSO, Sandeep RAZDAN, Aparna R. PRASAD
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Publication number: 20220278022Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.Type: ApplicationFiled: May 12, 2022Publication date: September 1, 2022Inventors: Ashley J.M. ERICKSON, Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J. M. PETERNEL, Aparna R. PRASAD
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Patent number: 11391897Abstract: Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.Type: GrantFiled: December 23, 2020Date of Patent: July 19, 2022Assignee: Cisco Technology, Inc.Inventors: Vipulkumar K. Patel, Paul Ton, Aparna R. Prasad, Norbert Schlepple
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Patent number: 11373930Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.Type: GrantFiled: March 31, 2020Date of Patent: June 28, 2022Assignee: Cisco Technology, Inc.Inventors: Ashley J. M. Erickson, Matthew J. Traverso, Sandeep Razdan, Joyce J. M. Peternel, Aparna R. Prasad
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Publication number: 20220196933Abstract: Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.Type: ApplicationFiled: December 23, 2020Publication date: June 23, 2022Inventors: Vipulkumar K. PATEL, Paul TON, Aparna R. PRASAD, Norbert SCHLEPPLE
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Patent number: 11353668Abstract: An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.Type: GrantFiled: October 14, 2020Date of Patent: June 7, 2022Assignee: Cisco Technology, Inc.Inventors: Ashley J. M. Erickson, Vipulkumar K. Patel, Aparna R. Prasad
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Publication number: 20220113480Abstract: An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.Type: ApplicationFiled: October 14, 2020Publication date: April 14, 2022Inventors: Ashley J.M. ERICKSON, Vipulkumar K. PATEL, Aparna R. PRASAD
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Patent number: 11215775Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.Type: GrantFiled: August 19, 2019Date of Patent: January 4, 2022Assignee: Cisco Technology, Inc.Inventors: Ashley J. Maker, Joyce J. M. Peternel, Sandeep Razdan, Matthew J. Traverso, Aparna R. Prasad
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Patent number: 11181689Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.Type: GrantFiled: September 23, 2019Date of Patent: November 23, 2021Assignee: Cisco Technology, Inc.Inventors: Sandeep Razdan, Vipulkumar K. Patel, Aparna R. Prasad
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Publication number: 20210305128Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.Type: ApplicationFiled: March 31, 2020Publication date: September 30, 2021Inventors: Ashley J.M. ERICKSON, Matthew J. TRAVERSO, Sandeep RAZDAN, Joyce J.M. PETERNEL, Aparna R. PRASAD
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Patent number: 11029475Abstract: The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.Type: GrantFiled: July 25, 2019Date of Patent: June 8, 2021Assignee: Cisco Technology, Inc.Inventors: Vipulkumar K. Patel, Aparna R. Prasad, Sandeep Razdan
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Publication number: 20210088722Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.Type: ApplicationFiled: September 23, 2019Publication date: March 25, 2021Inventors: Sandeep RAZDAN, Vipulkumar K. PATEL, Aparna R. PRASAD
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Publication number: 20210055489Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.Type: ApplicationFiled: August 19, 2019Publication date: February 25, 2021Inventors: Ashley J. MAKER, Joyce J. M. PETERNEL, Sandeep RAZDAN, Matthew J. TRAVERSO, Aparna R. PRASAD
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Publication number: 20200319416Abstract: The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.Type: ApplicationFiled: July 25, 2019Publication date: October 8, 2020Inventors: Vipulkumar K. PATEL, Aparna R. PRASAD, Sandeep RAZDAN